Intel mPGA604 - page 10

Assembled Component and Package Description

10 mPGA604 Socket

Mechanical Design Guide

Contents

Main Page Contents Figures Tables Revision History Re-Validation Notice to Socket Vendors 1 Introduction 1.1 Objective 1.2 Purpose 1.3 Scope Page 2 Assembled Component and Package Description Page 3 Mechanical Requirements 3.1 Attachment 3.2 Materials 3.2.1 Socket Housing 3.2.2 Color 3.5 Markings 3.5.1 Name mPGA604 3.5.2 Lock (Closed) and Unlock (Open) Markings 3.5.3 Lot Traceability 3.7 Socket/Package Translation During Actuation 3.8 Orientation in Packaging, Shipping and Handling 3.9 Contact Characteristics 3.10 Material and Recycling Requirements 3.11 Lever Actuation Requirements 3.12 Socket Engagement/Disengagement Force 3.13 Visual Aids 3.14 Socket BGA Co-Planarity 3.15 Solder Ball True Position Page Page 4 Electrical Requirements 4.1 Electrical Resistance Page Page Electrical Requirements mPGA604 Socket 21 Mechanical Design Guide Table 4-3. Resistance Test Fixture Netlist (Sheet 1 of 2) 4.2 Determination of Maximum Electrical Resistance 4.3 Inductance 4.3.1 Design Procedure for Inductance Measurements L L L L 4.4 Pin-to-Pin Capacitance 4.5 Dielectric Withstand Voltage 4.6 Insulation Resistance 4.7 Contact Current Rating Page 5 Environmental Requirements 5.1 Mixed Flowing Gas 5.2 Solvent Resistance 5.3 Durability 6 Validation Testing Requirements 6.7 Quality Assurance Requirements 6.8 Socket Test Plan 6.8.1 Submission of an mPGA604 Socket for Validation Testing 6.9 Mechanical Samples 6.10 Socket Validation Notification 7 Safety Requirements Page 8 Documentation Requirements Page 9 Mechanical Drawings