Intel mPGA604 1 Introduction

R
mPGA604 Socket 7
Mechanical Design Guide
1 Introduction
1.1 Objective
This document defines a surface mount, Zero Insertion Force (ZIF) socket intended for workstation
and server platforms based on Intel microprocessors. The socket provides I/O, power and ground
contacts. The socket contains 604 contacts arrayed about a cavity in the center of the socket with
solder balls/surface mount features for surface mounting with the motherboard. The mPGA604
Socket contacts have 1.27mm pitch with regular pin array, to mate with a 604-pin processor
package. A 604-pin package will be mated with a 603 solder ball socket. The dummy pin is a key
that allows either the 603-pin processor package or the 604-pin processor package to be used in the
same socket.
1.2 Purpose
To define functional, quality, reliability, and material (that is, visual, dimensional and physical)
requirements and design guidelines of the mPGA604 Socket in order to provide low cost, low risk,
robust, high volume manufacturable (HVM) socket solution available from multiple sources.
1.3 Scope
This design guideline applies to all 604-pin ZIF sockets purchased to the requirements of this design
guideline.
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