R
mPGA604 Socket 3
Mechanical Design Guide
Contents 1 Introduction....................................................................................................................... 7
1.1 Objective................................................................................................................ 7
1.2 Purpose..................................................................................................................7
1.3 Scope.....................................................................................................................7
2 Assembled Component and Package Description........................................................9
3 Mechanical Requirements..............................................................................................11
3.1 Attachment...........................................................................................................11
3.2 Materials...............................................................................................................11
3.2.1 Socket Housing....................................................................................... 11
3.2.2 Color........................................................................................................11
3.3 Cutouts for Package Removal............................................................................. 11
3.4 Socket Standoffs Height ......................................................................................11
3.5 Markings...............................................................................................................12
3.5.1 Name.......................................................................................................12
3.5.2 Lock (Closed) and Unlock (Open) Markings...........................................12
3.5.3 Lot Traceability........................................................................................12
3.6 Socket Size.......................................................................................................... 12
3.7 Socket/Package Translation During Actuation.................................................... 13
3.8 Orientation in Packaging, Shipping and Handling............................................... 13
3.9 Contact Characteristics........................................................................................13
3.9.1 Number of contacts................................................................................. 13
3.9.2 Base Material.......................................................................................... 13
3.9.3 Contact Area Plating............................................................................... 13
3.9.4 Solder Ball Attachment Area Plating.......................................................13
3.9.5 Solder Ball Characteristics...................................................................... 13
3.9.6 Lubricants................................................................................................13
3.10 Material and Recycling Requirements.................................................................13
3.11 Lever Actuation Requirements.............................................................................14
3.12 Socket Engagement/Disengagement Force........................................................14
3.13 Visual Aids........................................................................................................... 14
3.14 Socket BGA Co-Planarity.....................................................................................14
3.15 Solder Ball True Position..................................................................................... 14
3.16 Critical-to-Function Dimensions...........................................................................14
4 Electrical Requirements................................................................................................. 17
4.1 Electrical Resistance............................................................................................18
4.2 Determination of Maximum Electrical Resistance ...............................................22
4.3 Inductance............................................................................................................23
4.3.1 Design Procedure for Inductance Measurements.................................. 24
4.3.2 Correlation of Measurement and Model Data Inductance...................... 25
4.4 Pin-to-Pin Capacitance........................................................................................ 25
4.5 Dielectric Withstand Voltage................................................................................ 25
4.6 Insulation Resistance...........................................................................................25
4.7 Contact Current Rating........................................................................................ 25
5 Environmental Requirements........................................................................................ 27
5.1 Mixed Flowing Gas ..............................................................................................28