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Mechanical Requirements
mPGA604 Socket 13
Mechanical Design Guide
3.7 Socket/Package Translation During Actuation The socket shall be built so that the post-actuated package pin field displacement will not exceed
1.27 mm. Movement will be along the Y direction. No Z-axis travel (lift out) of the package is
allowed during actuation.
3.8 Orientation in Packaging, Shipping and Handling Packaging media needs to support high volume manufacturing.
3.9 Contact Characteristics 3.9.1 Number of contacts
Total number of contacts: 603.
Total number of contact holes: 604.
3.9.2 Base Material
High strength copper alloy.
3.9.3 Contact Area Plating
0.762 µm (min) gold plating over 1.27 µm (min) nickel underplate in critical contact areas (area on
socket contacts where processor pins will mate) is required. No contamination by solder in the
contact area is allowed during solder reflow.
3.9.4 Solder Ball Attachment Area Plating
3.81 µm (min) Tin/Lead (typically 85+-5Sn/Pb balance).
3.9.5 Solder Ball Characteristics
Tin/Lead (63/37 + 0.5% Sn).
3.9.6 Lubricants
For the final assembled product, no lubricant is permitted on the socket contacts. If lubricants are
used elsewhere within the socket assembly, these lubricants must not be able to migrate to the
socket contacts.
3.10 Material and Recycling Requirements Cadmium shall not be used in the painting or plating of the socket.