Intel mPGA604 4.3 Inductance

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Electrical Requirements

mPGA604 Socket 23

Mechanical Design Guide

4.3 Inductance

The bottom fixture for the inductance measurement is a ground plane on the secondary side of the

motherboard with all pins grounded. The component side of the socket PCB does not contain a

plane. The top fixture is the package, which contains pins that will connect to the socket. Figure 4-4

shows the inductance measurement fixture cross-section and the inductance measurement

methodology. The first figure shows the entire assembly. The second figure shows the assembly

without the socket; the socket-seating plane of the package is directly mounted to the component

side of the socket PCB. This is used to calibrate out the fixture contribution. The materials for the

fixture must match the materials used in the processor. Note the probe pad features exist on the

topside of the top fixture, and the shorting plane exists only on the bottom side of the bottom fixture.

Figure 4-5 presents the inductance and capacitance fixture design.

Figure 4-4. Inductance Measurement Fixture Cross-Section

Figure 4-5. Inductance and Capacitance Fixture

Contents

Main Page Contents Figures Tables Revision History Re-Validation Notice to Socket Vendors 1 Introduction 1.1 Objective 1.2 Purpose 1.3 Scope Page 2 Assembled Component and Package Description Page 3 Mechanical Requirements 3.1 Attachment 3.2 Materials 3.2.1 Socket Housing 3.2.2 Color 3.5 Markings 3.5.1 Name mPGA604 3.5.2 Lock (Closed) and Unlock (Open) Markings 3.5.3 Lot Traceability 3.7 Socket/Package Translation During Actuation 3.8 Orientation in Packaging, Shipping and Handling 3.9 Contact Characteristics 3.10 Material and Recycling Requirements 3.11 Lever Actuation Requirements 3.12 Socket Engagement/Disengagement Force 3.13 Visual Aids 3.14 Socket BGA Co-Planarity 3.15 Solder Ball True Position Page Page 4 Electrical Requirements 4.1 Electrical Resistance Page Page Electrical Requirements mPGA604 Socket 21 Mechanical Design Guide Table 4-3. Resistance Test Fixture Netlist (Sheet 1 of 2) 4.2 Determination of Maximum Electrical Resistance 4.3 Inductance 4.3.1 Design Procedure for Inductance Measurements L L L L 4.4 Pin-to-Pin Capacitance 4.5 Dielectric Withstand Voltage 4.6 Insulation Resistance 4.7 Contact Current Rating Page 5 Environmental Requirements 5.1 Mixed Flowing Gas 5.2 Solvent Resistance 5.3 Durability 6 Validation Testing Requirements 6.7 Quality Assurance Requirements 6.8 Socket Test Plan 6.8.1 Submission of an mPGA604 Socket for Validation Testing 6.9 Mechanical Samples 6.10 Socket Validation Notification 7 Safety Requirements Page 8 Documentation Requirements Page 9 Mechanical Drawings