Intel mPGA604 4.4 Pin-to-Pin Capacitance , 4.5 Dielectric Withstand Voltage , 4.6 Insulation Resistance , 4.7 Contact Current Rating

Electrical Requirements

mPGA604 Socket 25

Mechanical Design Guide

To correlate the measurement and model data for loop inductance, one unit of measured socket

assembly (socket and shorted test fixture) and one unit of measured sandwich (shorted test fixture)

will be chosen for cross sectioning. Both units will be modeled based on data from cross sectioning

using Ansoft* 3D. The sandwich inductance will be subtracted from socket assembly inductance for

both measured and modeled data. This procedure results in loop inductance for socket contact. This

final result can be compared with the loop inductance from the supplier model for the socket. If

there is any difference between them, it will be called the de-embedded correction factor. Adding

the test board to the socket and then eliminating the contribution of the fixture creates this correction

factor because inductance is not linear.

4.4 Pin-to-Pin Capacitance

Pin-to-pin capacitance shall be measured using configuration 4, with the motherboard not connected

and only the measurements with the package mounted on the socket will be taken. Capture data at

frequency specified in item 5 of Table 4-1.

4.5 Dielectric Withstand Voltage

No disruptive discharge or leakage greater than 0.5 mA is allowed when subjected to 360 V RMS.

The sockets shall be tested according to EIA-364, Test Procedure 20A, Method 1. The sockets shall

be tested unmounted and unmated. Barometric pressure shall be equivalent to Sea Level. The

sample size is 25 contact-to-contact pairs on each of 4 sockets. The contacts shall be randomly

chosen.

4.6 Insulation Resistance

The Insulation Resistance shall be greater than 800 M Ohm when subjected to 500 V DC. The

sockets shall be tested according to EIA-364, Test Procedure 21. The sockets shall be tested

unmated and unmounted. The sample size is 25 contact-to-contact pairs on each of 4 sockets. The

contacts shall be randomly chosen.

4.7 Contact Current Rating

Measure and record the temperature rise when the socket is subjected to rated current of 0.8A. The

sockets shall be tested according to EIA-364, Test Procedure 70A, Test Method 1. The sockets shall

be mounted on a test-board and mated with a package so those 370 pins are connected in series. The

recommended Test-board is the FSETV4 Rev 1 and the recommended package is FSETV5 Rev 1.

The wiring list is shown below. Mount the thermocouple as near to contact N3 or N 7 as possible.

Short the daisy chains by means of the edge fingers if possible. Sample size is one socket.