NXP Semiconductors TDA8932B 10. Limiting values, 11. Thermal characteristics

TDA8932B_3 © NXP B.V. 21 June 2007. All rights reserved.
Product data sheet Rev. 03— 21 June 2007 16 of 48
NXP Semiconductors TDA8932B
Class-D audio amplifier
10. Limiting values
[1] VP = VDDP1 − VSSP1 = VDDP2 − VSSP2.
[2] Measured with respect to pin INREF; Vx < VDD + 0.3 V.
[3] Measured with respect to pin VSSD(HW); Vx < VDD + 0.3 V.
[4] Measured with respect to pin CGND; Vx < VDD + 0.3 V.
[5] VSS = VSSP1 = VSSP2; VDD = VDDP1 = VDDP2.
[6] Current limiting concept.
[7] Human Body Model (HBM); Rs= 1500 Ω; C = 100 pF
For pins 2, 3, 11, 14 and 15 Vesd =±1800 V.
[8] Machine Model (MM); Rs=0Ω; C = 200 pF; L = 0.75 µH.
11. Thermal characteristics
Table 8. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Max Unit
VPsupply voltage asymmetrical supply [1] −0.3 +40 V
Vxvoltage on pin x
IN1P, IN1N, IN2P, IN2N [2] −5+5V
OSCREF, OSCIO, TEST [3] VSSD(HW) − 0.3 5 V
POWERUP, ENGAGE,
DIAG
[4] VCGND − 0.3 6 V
all other pins [5] VSS − 0.3 VDD + 0.3 V
IORM repetitive peak output
current maximum output current limiting
[6] 4-A
Tjjunction temperature - 150 °C
Tstg storage temperature −55 +150 °C
Tamb ambient temperature −40 +85 °C
P power dissipation - 5 W
Vesd electrostatic discharge
voltage HBM [7] −2000 +2000 V
MM [8] −200 +200 V
Table 9. Thermal characteristics
Symbol Parameter Conditions Min Typ Max Unit
SO32 package
Rth(j-a) thermal resistance from junction
to ambient free air natural convection
JEDEC test board [1] - 41 44 K/W
2 layer application board [2] - 44 - K/W
Ψj-lead thermal characterization
parameter from junction to lead - - 30 K/W
Ψj-top thermal characterization
parameter from junction to top
[3] - - 8 K/W