NXP Semiconductors TDA8932B 4. Quick reference data, 5. Ordering information

TDA8932B_3 © NXP B.V. 21 June 2007. All rights reserved.
Product data sheet Rev. 03— 21 June 2007 2 of 48
NXP Semiconductors TDA8932B
Class-D audio amplifier
4. Quick reference data
[1] Output power is measured indirectly; based on RDSon measurement.
[2] Two layer application board (55 mm × 45 mm), 35 µm copper, FR4 base material in free air with natural
convection.
5. Ordering information
Table 1. Quick reference data
V
P
= 22 V; f
osc
= 320 kHz; T
amb
=25 ° C; unless otherwise specified.
Symbol Parameter Conditions Min Typ Max Unit
Supplies
VPsupply voltage asymmetrical supply 10 22 36 V
IPsupply current Sleep mode - 0.6 1.0 mA
Iq(tot) total quiescent
current Operating mode; no load, no snubbers and no filter
connected
- 4050mA
Stereo SE channel; Rs< 0.1 Ω[1]
Po(RMS) RMS output power continuous time output power
per channel;
THD+N = 10 %; fi= 1 kHz
RL=4Ω; VP= 22 V 13.8 15.3 - W
RL=8Ω; VP= 30 V 14.0 15.5 - W
short time output power per
channel; THD+N = 10 %;
fi= 1 kHz
[2]
RL=4Ω; VP= 29 V 23.8 26.5 - W
Mono BTL; Rs< 0.1 Ω[1]
Po(RMS) RMS output power continuous time output power;
THD+N = 10 %; fi= 1 kHz
RL=4Ω; VP= 12 V 15.5 17.2 - W
RL=8Ω; VP= 22 V 28.9 32.1 - W
short time output power;
THD+N = 10 %; fi= 1 kHz
[2]
RL=8Ω; VP= 29 V 49.5 55.0 - W
Table 2. Ordering information
Type number Package
Name Description Version
TDA8932BT SO32 plastic small outline package; 32 leads;
body width 7.5 mm SOT287-1
TDA8932BTW HTSSOP32 plastic thermal enhanced thin shrink small outline
package; 32 leads; body width 6.1 mm; lead pitch
0.65 mm; exposed die pad
SOT549-1