TDA8932B_3 © NXP B.V. 21 June 2007. All rights reserved.
Product data sheet Rev. 03— 21 June 2007 42 of 48
NXP Semiconductors TDA8932B
Class-D audio amplifier

Fig 41. Package outline SOT549-1 (HTSSOP32)

UNIT A1A2A3bpcD
(1) E(2) eH
ELL
pZywv θ
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC JEITA
mm 0.15
0.05 8
0
o
o
0.1
DIMENSIONS (mm are the original dimensions).
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
SOT549-1 03-04-07
05-11-02
wM
θ
A
A1
A2
Eh
Dh
D
Lp
detail X
E
Z
exposed die pad side
e
c
L
X
(A3)
0.25

116

32 17

y
b
HE
0.95
0.85 0.30
0.19
Dh
5.1
4.9
Eh
3.6
3.4
0.20
0.09 11.1
10.9 6.2
6.0 8.3
7.9
0.65 1 0.2 0.78
0.48
0.1
0.75
0.50
p
vMA
A

HTSSOP32: plastic thermal enhanced thin shrink small outline package; 32 leads;

body width 6.1 mm; lead pitch 0.65 mm; exposed die pad SOT549-1

A
max.
1.1
0
2.5
5 mm
scale
pin 1 index
MO-153