NXP Semiconductors TDA8932B 16. Package outline

TDA8932B_3 © NXP B.V. 21 June 2007. All rights reserved.
Product data sheet Rev. 03— 21 June 2007 41 of 48
NXP Semiconductors TDA8932B
Class-D audio amplifier
16. Package outline
Fig 40. Package outline SOT287-1 (SO32)
UNIT A
max. A1A2A3bpcD
(1) E(1) eH
ELL
pQZywv θ
REFERENCES
OUTLINE
VERSION EUROPEAN PROJECTION ISSUE DATE
IEC JEDEC JEITA
mm
inches
2.65
0.1
0.25
0.01
1.4
0.055
0.3
0.1 2.45 2.25 0.49 0.36 0.27 0.18 20.7 20.3 7.6 7.4 1.27 10.65 10.00 1.2 1.0 0.95 0.55 8
0
o
o
0.25 0.1
0.004
0.25
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
Note
1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.
1.1
0.4
SOT287-1 MO-119
(1)
0.012
0.004 0.096 0.089 0.02 0.01 0.05 0.047 0.039
0.419
0.394
0.30
0.29
0.81
0.80
0.011
0.007 0.037 0.022
0.010.01
0.043
0.016
wM
bp
D
HE
Z
e
c
vMA
X
A
y
32 17
16
1
θ
A
A1
A2
Lp
Q
detail X
L
(A )
3
E
pin 1 index
0 5 10 mm
scale
SO32: plastic small outline package; 32 leads; body width 7.5 mm SOT287-1
00-08-17
03-02-19