18 BLOCK DIAGRAM (HANDSET) 39
19 CIRCUIT OPERATION 40
19.1. Outline 40
19.2. PowerSupply Circuit 41
19.3. ResetCircuit (Base Unit) 42
19.4. ChargeCircuit 43
19.5. TelephoneLine Interface 43
19.6. DTMF 43
19.7. Transmitter/Receiver 44
19.8. SignalRoute 46
20 CIRCUIT OPERATION(HANDSET) 47
20.1. ResetCircuit (Handset) 47
20.2. BatteryLow / Power Down Detector 48
21 CPU DATA(Base Unit) 49
21.1. IC2 49
22 CPU DATA(Handset) 50
22.1. IC2 50
23 RF IC(Base Unit and Handset) 51
23.1. IC1 51
24 HOW TOREPLACE FLAT PACKAGEIC 52
24.1. Preparation 52
24.2. Procedure 52
24.3. ModificationProcedure of Bridge 52
25 CABINET ANDELECTR ICAL PARTS LOCATION (BASE UNIT)
53
26 CABINET ANDELECTR ICAL PARTS LOCATION (HANDET) 54
27 ACCESSORIES ANDPACKING MATERIALS 55
28 REPLACEMENT PARTSLIST 56
28.1. BaseUnit 56
28.2. Handset 58
28.3. ACCESSORIESAND PACKING MATERIALS 60
29 FOR SCHEMATICDIAGRAM 61
29.1. BaseUnit (SCHEMATIC DIAGRAM (Base Unit)) 61
29.2. Handset(SCHEMATIC DIAGRAM (Handset)) 61
30 SCHEMATIC DIAGRAM(Base Unit) 62
30.1. BaseUnit 62
30.2. RFUnit (Base Unit) 63
31 SCHEMATIC DIAGRAM(Handset) 64
31.1. Handset 64
31.2. RFUnit (Handset) 65
31.3. Memo 66
32 CIRCUIT BOARD(Base Unit) 67
32.1. ComponentView 67
32.2. FlowSolder Side View 68
33 CIRCUIT BOARD(Handset) 69
33.1. ComponentView 69
33.2. FlowSolder Side View 70
3
KX-TC2000NZB / KX-TC2000NZW / KX- TC2000NZF