18 | BLOCK DIAGRAM (HANDSET) | 39 | 25 | CABINET AND ELECTRICAL PARTS LOCATION (BASE UNIT) | |
19 | CIRCUIT OPERATION | 40 |
|
| 53 |
| 19.1. Outline | 40 | 26 | CABINET AND ELECTRICAL PARTS LOCATION (HANDET) | 54 |
| 19.2. Power Supply Circuit | 41 | 27 | ACCESSORIES AND PACKING MATERIALS | 55 |
| 19.3. Reset Circuit (Base Unit) | 42 | 28 | REPLACEMENT PARTS LIST | 56 |
| 19.4. Charge Circuit | 43 |
| 28.1. Base Unit | 56 |
| 19.5. Telephone Line Interface | 43 |
| 28.2. Handset | 58 |
| 19.6. DTMF | 43 |
| 28.3. ACCESSORIES AND PACKING MATERIALS | 60 |
| 19.7. Transmitter/Receiver | 44 | 29 | FOR SCHEMATIC DIAGRAM | 61 |
| 19.8. Signal Route | 46 |
| 29.1. Base Unit (SCHEMATIC DIAGRAM (Base Unit)) | 61 |
20 | CIRCUIT OPERATION (HANDSET) | 47 |
| 29.2. Handset (SCHEMATIC DIAGRAM (Handset)) | 61 |
| 20.1. Reset Circuit (Handset) | 47 | 30 | SCHEMATIC DIAGRAM (Base Unit) | 62 |
| 20.2. Battery Low / Power Down Detector | 48 |
| 30.1. Base Unit | 62 |
21 | CPU DATA (Base Unit) | 49 |
| 30.2. RF Unit (Base Unit) | 63 |
| 21.1. IC2 | 49 | 31 | SCHEMATIC DIAGRAM (Handset) | 64 |
22 | CPU DATA (Handset) | 50 |
| 31.1. Handset | 64 |
| 22.1. IC2 | 50 |
| 31.2. RF Unit (Handset) | 65 |
23 | RF IC (Base Unit and Handset) | 51 |
| 31.3. Memo | 66 |
| 23.1. IC1 | 51 | 32 | CIRCUIT BOARD (Base Unit) | 67 |
24 | HOW TO REPLACE FLAT PACKAGE IC | 52 |
| 32.1. Component View | 67 |
| 24.1. Preparation | 52 |
| 32.2. Flow Solder Side View | 68 |
| 24.2. Procedure | 52 | 33 | CIRCUIT BOARD (Handset) | 69 |
| 24.3. Modification Procedure of Bridge | 52 |
| 33.1. Component View | 69 |
|
|
|
| 33.2. Flow Solder Side View | 70 |
3
