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Panasonic KX-TC2000NZB, KX-TC2000NZF, KX-TC2000NZW 1.2. How to recognize that Pb Free solder is used

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1.2. How to recognize that Pb Free solder is used

1.2.1. Base Unit Main PCB

IC5

JK1

PbF

Marked

(Component View)

Note:

The location of the "PbF" marks is subject to change without notice.

1.2.2. Handset PCB

IC2

DPX1

PbF

Marked

(Component View)

Note:

The location of the "PbF" marks is subject to change without notice.

KX-TC2000NZB / KX-TC2000NZW / KX- TC2000NZF

Contents

Main CONTENTS Page Page Page 1 ABOUT LEAD FREE SOLDER (PbF: Pb free) 1.1. Suggested PbF Solder 1.2. How to recognize that Pb Free solder is used 1.2.1. Base Unit Main PCB Marked 1.2.2. Handset PCB Marked Page Page Page Page 7 CONNECTION Page Page Page Page Page Page Page 10 TROUBLESHOOTING GUIDE 10.1. Check Power 10.2. Bell Reception 10.3. Check Battery Charge Page Page Page 11 ADJUSTMENTS (BASE UNIT) 11.1. Test Mode Flow Chart (Base Unit) 11.2. How to change the channel *: Refer to Flow Solder Side View (P.68). 11.3. Adjustment 11.4. Adjustment Standard (Base Unit) When connecting the Simulator and Equipments for checkin g,please refer to the illustrat ion below. IC2 IC3 IC1 12 ADJUSTMENTS (HANDSET) 12.1. Test Mode Flow Chart (Handset) 12.2. How to change the channel 12.3. Adjustment 12.4. Adjustment Standard (Handset) (A) Battery Low T1 T6 DPX1 (Flow Solder Side View) IC1 Note: (A)-(I) is refered to ADJUSTMENTS (HANDSET) (P.28) 13 RF SPECIFICATION 13.1. Base Unit 13.2. Handset 14 HOW TO CHECK THE HANDSET SPEAKER 15 FREQUENCY TABLE (MHz) Page Page Page 16.5.1. Handset 16.5.2. Base Unit 17 BLOCK DIAGRAM (BASE UNIT) RF IC IC1 TELEPHONE LINE INTERFACE CPU IC2 POWER SUPPLY RESET CHARGE 18 BLOCK DIAGRAM (HANDSET) RF IC IC1 CPU IC2 19 CIRCUIT OPERATION 19.1. Outline 19.2. Power SupplyCircuit Page 19.4. Charge Circuit 19.5. Telephone Line Interface 19.6. DTMF 19.7. Transmitter/Receiver 19.7.1. Base to Handset 19.7.2. Handset to Base 19.7.3. RF signal operation/control and PLLoperation (RFUNIT) Page Page 20.2. Battery Low / Power Down Detector Page Page Page 24 HOW TO REPLACE FLAT PACKAGE IC 24.1. Preparation 24.2. Procedure 24.3. Modification Procedure of Bridge Page Page Page 28 REPLACEMENT PARTS LIST 28.1. Base Unit 28.1.1. CABINET ANDELECTRICAL PARTS 28.1.2. MAIN P.C.BOARDPARTS Page 28.2. Handset 28.2.1. CABINET AND ELECTRICAL PARTS 28.2.2. MAIN P.C.BOARD PARTS 28.3. ACCESSORIES AND PACKING MATERIALS 29 FOR SCHEMATIC DIAGRAM 30 SCHEMATIC DIAGRAM (Base Unit) 30.1. Base Unit IC5 IC3C IC3A 30.2. RF Unit (Base Unit) RX TX KX-TC2000NZB/NZW/NZF SCHEMATIC DIAGRAM (Base Unit) 4.4V455kHz 10.695MHz IC1 31 SCHEMATIC DIAGRAM (Handset) 31.1. Handset 3.9V0V IC2 3.9V to 0V 31.2. RF Unit (Handset) 2.1V 455kHz RX TX KX-TC2000NZB/NZW/NZF SCHEMATIC DIAGRAM (RF Unit (Handset)) Page 32 CIRCUIT BOARD (Base Unit) 32.1. Component View C95 T7 R107 32.2. Flow Solder Side View (RF IC: 36) IF IN GND TX-VCO 2nd Mix IC2 33 CIRCUIT BOARD (Handset) 33.1. Component View Battery Low RSSI T1 33.2. Flow Solder Side View IC1 RX VCO TXPOWER 2nd Mix (RF IC: 36) TXGND