Manuals
/
Brands
/
Communications
/
Telephone
/
Panasonic
/
Communications
/
Telephone
Panasonic
KX-TC2000NZB, KX-TC2000NZF, KX-TC2000NZW
10 TROUBLESHOOTING GUIDE
1
18
71
71
Download
71 pages, 1.62 Mb
10 TROUBLESHOOTING
GUIDE
Cross Reference:
Check Power
(P.19)
Bell Reception
(P.20)
Check Battery Charge
(P.21)
Check Link
(P.22)
Check Handset Transmission
(P.24)
Check Handset Reception
(P.24)
18
KX-TC2000NZB / KX-TC2000NZW / KX- TC2000NZF
Contents
Main
CONTENTS
Page Page
Page
1 ABOUT LEAD FREE SOLDER (PbF: Pb free)
1.1. Suggested PbF Solder
1.2. How to recognize that Pb Free solder is used
1.2.1. Base Unit Main PCB
Marked
1.2.2. Handset PCB
Marked
Page
Page
Page
Page
7 CONNECTION
Page
Page
Page
Page
Page
Page
Page
10 TROUBLESHOOTING GUIDE
10.1. Check Power
10.2. Bell Reception
10.3. Check Battery Charge
Page
Page
Page
11 ADJUSTMENTS (BASE UNIT)
11.1. Test Mode Flow Chart (Base Unit)
11.2. How to change the channel
*: Refer to Flow Solder Side View (P.68).
11.3. Adjustment
11.4. Adjustment Standard (Base Unit)
When connecting the Simulator and Equipments for checkin g,please refer to the illustrat ion below.
IC2
IC3
IC1
12 ADJUSTMENTS (HANDSET)
12.1. Test Mode Flow Chart (Handset)
12.2. How to change the channel
12.3. Adjustment
12.4. Adjustment Standard (Handset)
(A) Battery Low
T1
T6
DPX1
(Flow Solder Side View)
IC1
Note: (A)-(I) is refered to ADJUSTMENTS (HANDSET) (P.28)
13 RF SPECIFICATION
13.1. Base Unit
13.2. Handset
14 HOW TO CHECK THE HANDSET SPEAKER
15 FREQUENCY TABLE (MHz)
Page
Page
Page
16.5.1. Handset
16.5.2. Base Unit
17 BLOCK DIAGRAM (BASE UNIT)
RF IC IC1
TELEPHONE LINE INTERFACE
CPU IC2
POWER SUPPLY RESET CHARGE
18 BLOCK DIAGRAM (HANDSET)
RF IC IC1
CPU IC2
19 CIRCUIT OPERATION
19.1. Outline
19.2. Power SupplyCircuit
Page
19.4. Charge Circuit
19.5. Telephone Line Interface
19.6. DTMF
19.7. Transmitter/Receiver
19.7.1. Base to Handset
19.7.2. Handset to Base
19.7.3. RF signal operation/control and PLLoperation (RFUNIT)
Page
Page
20.2. Battery Low / Power Down Detector
Page
Page
Page
24 HOW TO REPLACE FLAT PACKAGE IC
24.1. Preparation
24.2. Procedure
24.3. Modification Procedure of Bridge
Page
Page
Page
28 REPLACEMENT PARTS LIST
28.1. Base Unit
28.1.1. CABINET ANDELECTRICAL PARTS
28.1.2. MAIN P.C.BOARDPARTS
Page
28.2. Handset
28.2.1. CABINET AND ELECTRICAL PARTS
28.2.2. MAIN P.C.BOARD PARTS
28.3. ACCESSORIES AND PACKING MATERIALS
29 FOR SCHEMATIC DIAGRAM
30 SCHEMATIC DIAGRAM (Base Unit)
30.1. Base Unit
IC5
IC3C
IC3A
30.2. RF Unit (Base Unit)
RX TX
KX-TC2000NZB/NZW/NZF SCHEMATIC DIAGRAM (Base Unit)
4.4V455kHz 10.695MHz
IC1
31 SCHEMATIC DIAGRAM (Handset)
31.1. Handset
3.9V0V
IC2
3.9V to 0V
31.2. RF Unit (Handset)
2.1V
455kHz
RX TX
KX-TC2000NZB/NZW/NZF SCHEMATIC DIAGRAM (RF Unit (Handset))
Page
32 CIRCUIT BOARD (Base Unit)
32.1. Component View
C95
T7
R107
32.2. Flow Solder Side View
(RF IC: 36) IF IN
GND
TX-VCO 2nd Mix
IC2
33 CIRCUIT BOARD (Handset)
33.1. Component View
Battery Low
RSSI
T1
33.2. Flow Solder Side View
IC1
RX VCO
TXPOWER 2nd Mix (RF IC: 36)
TXGND