86

 

240PW9 LCD

 

 

 

3. Lead-free product identification

Repair Tips

Y ou can identify lead-free product by Philips-lead-free logo on PCB.

4. Lead-free product repair instruction

4.1 Use only lead-free Solder Alloy 0622 149 00106(1.2mm SAC305) or 0622 14900108(1.0mm SAC305).

Remark: For lead free soldering material, please visit www.alphametals.com website for details. This is recommended by Philips.

4.2 Use only adequate solder tools applicable for lead-free soldering-tin. The solder tool must be able to reach at least a

solder-temperature of 400 , to stabilize the adjusted temperature at the solder-tip and to exchange solder-tips for different applications. Small Passives/Actives to be removed with thermal tweezers

Automated system for I C and BGA repair (Microscope, Camera, Beam split optics, Computer , P rogrammer , Heat controllers, V acuum system, Laser pointer) Solder Hand-T ool (Adjustable in temperature height, Temperature shall be held constant,Flexible tips)

4.3 Adjust your solder tool so that a temperature around 360 -380 is reached and stabilized at the solder joint.

Heating-time of the solder-joint should not excee d ~ 4 s e c . Avoid temperatures above 400 otherwise wear-out of tips will rise drastically and flux-fluid will be destroyed.Corrosion of Tool-Spikes can be avoided when using SAC305 and a temperature of less than 400 .

4.4Mix of lead-free solder-tin/parts with leaded soldering-tin/parts is possible but not recommended. If not to avoid clean carefully the solder-joint from old tin and re-solder with new tin.

4.5 Use only original spare-parts listed in the Service-Manuals. Standard-material(consumables) can also be purchased at external companies.

4.6Special information for lead-free BGA-ICs: this ICs will be delivered in so-called dry-packaging to protect the I C against moisture and with lead-free logo on it. This packaging may only be opened shortly before it is used (soldered). Otherwise the body of the I C gets wet inside and during the heating time the structure of the I C will be destroyed due to high (steam-)pressure. If the packaging was opened before usage the I C has to be heated up for some hours (around 90 ) for drying (T ake attention for ESD-protection!)

5. Rework on BGA (Ball Grid Array) ICs

General

 

Although (LF)BGA

assembly yields are very high, there may still be a requirement for component rework. By rework, we

mean the process

of removing the component from the PWB and replacing it with a new component. If an (LF)BGA is

removed from a P WB, the solder balls of the component are deformed drastically so the removed (LF)BGA has to be discarded.

Device Removal

As is the case with any component that, it is essential when removing an (LF)BGA, the board, tracks, solder lands, or surrounding components are not damaged. To remove an (LF)BGA, the board must be uniformly heated to a temperature close to the reflow soldering temperature. A uniform temperature reduces the chance of warping the PWB.

To do this, we recommend that the board is heated until it is certain that all the joints are molten. Then carefully pull the component off the board with a vacuum nozzle. For the appropriate temperature profiles, see the IC data sheet.

Area Preparation

When the component has been removed, the vacant IC area must be cleaned before replacing the (LF)BGA.

Removing an IC often leaves varying amounts of solder on the mounting lands. This excessive solder can be removed with either a solder sucker or solder wick. The remaining flux can be removed with a brush and cleaning agent. After the board is properly cleaned and inspected, apply flux on the solder lands and on the connection balls of the(LF)BGA

Note: Do not apply solder paste, as this has shown to result in problems during re-soldering.

Device Replacement

The last step in the repair process is to solder the new component on the board. Ideally , the (LF)BGA should be aligned under a microscope or magnifying glass. If this is not possible, try to align the (LF)BGA with any board markers. To reflow the solder , apply a temperature profile according to the IC data sheet. So as not to damage neighbouring components, it may be necessary to reduce some temperatures and times.

More Information

For more information on how to handle BGA devices, visit this URL: http://www.atyourservice.ce.philips.com (needs subscription). After login, select Magazine , then go to W orkshop Information . H ere you will find Information on how

.to deal with BGA-ICs.

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Philips 240PW9EB/75, 240PW9ES /00, 240PW9EB/27, 240PW9EB/00, 240PW9EB/69 manual Lead-free product identification
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240PW9EB/27, 240PW9EB/75, 240PW9EB/69, 240PW9EB/00, 240PW9ES /00 specifications

The Philips 240PW9 series comprises a range of versatile monitors, including models such as the 240PW9ES/00, 240PW9EB/00, 240PW9EB/69, 240PW9EB/75, and 240PW9EB/27. These displays cater primarily to professionals seeking a balance between performance, ergonomics, and visual quality, making them suitable for both office environments and creative workspaces.

One of the standout features of the 240PW9 series is its high-resolution display, typically offering a 1920 x 1200 resolution. This extra vertical screen space is particularly advantageous for multitasking, allowing users to view documents side by side or keep multiple applications open simultaneously without sacrificing clarity.

The monitors also employ advanced LCD technology, providing vivid color reproduction and sharp image quality. With an impressive contrast ratio, these monitors deliver deep blacks and bright whites, enhancing the overall viewing experience. The IPS (In-Plane Switching) panel used in these models ensures wide viewing angles, making it easier for multiple users to view the screen without color distortion.

Another key characteristic of the Philips 240PW9 models is their ergonomic design. Many of the monitors in this series come equipped with height-adjustable stands, allowing users to customize the monitor's position for optimal comfort. Additionally, features such as tilt and swivel capabilities enhance the viewing experience, promoting better posture during long hours of work.

Connectivity options are ample across the Philips 240PW9 series. Users can expect to find multiple inputs, including VGA, DVI, and DisplayPort, facilitating easy connections to various devices such as computers, laptops, and even projectors. This flexibility ensures that users can easily integrate the monitors into their existing setup without requiring additional adapters.

Philips prioritizes eye comfort by incorporating Flicker-Free technology, which reduces eye strain during extended use. Blue Light Filter options further protect users by diminishing the amount of harmful blue light emitted from the screen, contributing to a healthier working environment.

In summary, the Philips 240PW9ES/00, 240PW9EB/00, 240PW9EB/69, 240PW9EB/75, and 240PW9EB/27 models encapsulate a well-rounded package of exceptional display quality, ergonomic features, and versatile connectivity options, making them an excellent choice for professionals seeking reliable and high-quality performance in their workspaces. These monitors reflect Philips' commitment to innovation and user-centric design, ultimately helping to enhance productivity without compromising on comfort.
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