NO | ITEMS | TEST CONDITION | PERFORMANCE | |||
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| SOLDER TEMPERATURE : 245±5℃ | MORE THAN 95% OF THE | |||
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| DIP TIME : 3±0.5 SEC. |
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12 | SOLDERABILITY |
| TERMINAL SURFACE MUST BE | |||
SOLDER : |
| SOLDERED NEWLY. | ||||
| FLUX : ROSIN(KSM2951)+Solvent(ISA) | |||||
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| (ROSIN 25WT%) |
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| PREHEAT : 100 110 |
| FOR 30 SEC. |
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| ∼ | ℃ |
| CHANGE IN CAPACITANCE : | |
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| ℃ | |||
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| TEMPERATURE : 260±5 |
| ±5% OF INITIAL VALUE | ||
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| DIP TIME : 10 ±1 SEC |
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| TANGENT OF LOSS ANGLE : | |||
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| ALL SAMPLES SHALL BE DIPPED IN SOLDER | LEAKAGE CURRENT : | |||
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| APPEARANCE : | ||||
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| BATH. MEASUREMENT SHALL BE MADE AT | ||||
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| THERE SHALL BE NO EVIDENCE | ||||
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| ROOM TEMPERATURE AFTER 1~2 HOURS OF | ||||
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| OF MECHANICAL DAMAGE. . | ||||
| RESISTANCE | COOLING TIME. |
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13 | TO SOLDERING |
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CONVECTION REFLOW |
| Change in capacitance: | ||||
| HEAT | ∼ | ℃ | FOR 130 SEC. | ||
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| PREHEAT : 150 190 |
| ±10% of initial value | ||
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| ℃ | ||
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| PEAK TEMPERATURE : 260±5 FOR 10 SEC. | Tangent of loss angle: | |||
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| METHOD : SAMPLES SHALL BE PASSED | ||||
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| REFLOW 3 TIMES. |
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| Leakage Current : | |
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| MEASUREMENT SHALL BE MADE AT ROOM | ||||
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| TEMPERATURE AFTER 3 4 HOURS OF |
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| ∼ |
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| COOLING TIME. |
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| THERE SHALL BE NO EVIDENCE | |
| RESISTANCE | IMMERSION CLEANING |
| OF MECHANICAL DAMAGE. AND | ||
| THE CAPACITOR SHALL BE CLEANED AT | MARKING SHALL BE LEGIBLE. | ||||
14 | TO | |||||
ROOM TEMPERATURE FOR 60sec. USING | ELECTRICAL CHARACTERISTICS | |||||
| CLEAN TEST | |||||
| ISOPROPYL ALCOHOL |
| SHALL SATISFY THE INITIAL | |||
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| REQUIREMENT. | |
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| VIBRATION | FREQUENCY : 10 to 55 to 10Hz (in 1 min.) MAX | CHANGE IN CAPACITANCE : | |||
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| AMPLITUDE : 1.5 mm. |
| WITHIN : ±5% OF THE INITIAL | ||
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| DIRECTION OF VIBRATION : IN DIRECTION OF | VALUE | |||
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| X,Y AND Z AXES |
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| TANGENT OF LOSS ANGLE : | |
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| TIME : 2 HOURS EACH DIRECTION AND 6 |
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| HOURS IN TOTAL |
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| LEAKAGE CURRENT : | |
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| DURING THE LAST 30 min. OF VIBRATION IN |
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15 |
| EACH DIRECTION, THE CAPACITANCE SHALL | APPEARANCE : | |||
| BE MEASURED 3 TO 5 TIMES. | THERE SHALL BE NO EVIDENCE | ||||
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| FOR OTHER PROCEDURES REFER TO IEC | OF MECHANICAL DAMAGE. . | |||
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| Pub. |
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| MOUNTING METHOD |
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SOLDER
ALUMINA
BOARD
SCL Series