Technical Specifications
18
SAMSUNG continually strives to improve its products. Both the design
specifications and these user instructions are thus subject to change without
notice.
CD-R
(write mode)
(write mode)
600 KB/sec. (4X), 1 200 KB/sec. (8X)
1800 KB/sec. (12X), 2400 KB/sec. (16X)
3000 KB/sec. (20X), 3600 KB/sec. (24X)
Disc
Error rate
Rear Panel
Front Panel
Operating
Environment
General
Reliability
Drive
Performance
Disc diameter
Disc types supported
in read mode
Data transfer rate
Access time (typical)
Laser
Slide mechanism
Spindle motor
Load mechanism
Eject button
Indicator (LED)
Headphone output
Volume control
Dimensions
Net weight
Operations
Storage
Required power
Interface connector
Audio output
Jumper block
MTBF
CD-DA, CD-ROM mode 1, CD-ROM XA mode 2, Form 1, Form 2,
CD-Plus, CD-Extra, Photo-CD (Single, Multi-session), Video CD
ready, Enhanced CD, CD-I/FMV, CD-R, CD-RW, CD-TEXT
120 mm or 80 mm
Erasing disc types
CD-RW
Read mode
90ms (typical)
Stepping motor
Brushless motor
Tray. DC motor (Soft Eject).
Mode 1: 1 block/1012, Mode 2: 1 block/109
Auto eject or Auto inject
Green when playing or recording a disc
Stereo mini-jack (
Ø 3.6 mm)
0.60±20% (vrms) 33 Ω
Dial type
+5 VDC: 1.5 A (max.), +12 VDC: 1.5 A (max.)
ATAPI (EIDE)
Line out 0.75 ±20% (vrms): 47 KΩ
Device configuration jumper
Temperature: 0~50°C Humidity: 10~80%
148.2 (W)
x
42 (H)
x
184 (D) mm (including bezel)
770 g
125 000 POH (20% duty)
Semiconductor laser
Item SW-224
Temperature: -25~55°C Humidity: 10~90%
600 KB/sec. (4X), 1500 KB/sec. (10X)
6,000 KB/sec. (max.), PIO Mode 4, DMA Mode 2
CD-R, CD-RW
Disc types supported
in write mode
CD-RW