8. Package Markings (Top Marks)
8.1. Si4734/35 Top Mark
3420 BTTT YWW
3520 BTTT YWW
8.2. Top Mark Explanation
Mark Method: | YAG Laser |
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Line 1 Marking: | Part Number | 34 = Si4734, 35 = Si4735 |
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| Firmware Revision | 20 = Firmware Revision 2.0 |
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Line 2 Marking: | Die Revision | B = Revision B Die |
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| TTT = Internal Code | Internal tracking code. |
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Line 3 Marking: | Circle = 0.5 mm Diameter | Pin 1 Identifier |
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| Y = Year | Assigned by the Assembly House. Corresponds to the last sig- |
| WW = Workweek | nificant digit of the year and workweek of the mold date. |
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32 | Rev. 1.0 |
