MII/RMII 10/100 Ethernet Transceiver with HP
Datasheet
7.1.1.1Human Body Model (HBM) Performance
HBM testing verifies the ability to withstand the ESD strikes like those that occur during handling and manufacturing, and is done without power applied to the IC. To pass the test, the device must have no change in operation or performance due to the event. All pins on the LAN8710 provide
7.1.1.2IEC61000-4-2 Performance
The
SMSC contracts with Independent laboratories to test the LAN8710 to
In addition to defining the ESD tests, IEC
Both air discharge and contact discharge test techniques for applying stress conditions are defined by the
AIR DISCHARGE
To perform this test, a charged electrode is moved close to the system being tested until a spark is generated. This test is difficult to reproduce because the discharge is influenced by such factors as humidity, the speed of approach of the electrode, and construction of the test equipment.
CONTACT DISCHARGE
The uncharged electrode first contacts the pin to prepare this test, and then the probe tip is energized. This yields more repeatable results, and is the preferred test method. The independent test laboratories contracted by SMSC provide test results for both types of discharge methods.
7.1.2Operating Conditions
Table 7.3 Recommended Operating Conditions
PARAMETER |
| CONDITIONS | MIN | TYP | MAX | UNITS | COMMENT |
|
|
|
|
|
|
| |
VDD1A, VDD2A | To VSS ground | 3.0 | 3.3 | 3.6 | V |
| |
|
|
|
|
|
|
| |
VDDIO | To VSS ground | 1.6 | 3.3 | 3.6 | V |
| |
|
|
|
|
|
|
|
|
Input Voltage on |
|
| 0.0 |
| VDDIO | V |
|
Digital Pins |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Voltage on Analog I/O |
|
| 0.0 |
| +3.6V | V |
|
pins (RXP, RXN) |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Ambient Temperature | T | 0 |
| +85 | oC | For Extended Commercial | |
| A |
|
|
|
|
| Temperature |
|
|
|
|
|
|
| |
|
|
|
|
|
|
|
|
| T |
| +85 | oC | For Industrial Temperature | ||
| A |
|
|
|
|
|
|
SMSC LAN8710/LAN8710i | 67 | Revision 1.0 |
| DATASHEET |
|