MII/RMII 10/100 Ethernet Transceiver with HP Auto-MDIX and flexPWR® Technology in a Small Footprint

Datasheet

Chapter 9 Package Outline

Figure 9.1 LAN8710/LAN8710i-EZK 32 Pin QFN Package Outline, 5 x 5 x 0.9 mm Body (Lead-Free)

 

 

 

Table 9.1 32 Terminal QFN Package Parameters

 

 

 

 

 

 

 

 

MIN

NOMINAL

MAX

REMARKS

 

 

 

 

 

 

 

A

0.70

~

1.00

Overall Package Height

 

A1

0

0.02

0.05

Standoff

 

A2

~

~

0.90

Mold Thickness

 

A3

 

0.20 REF

 

Copper Lead-frame Substrate

 

D

4.85

5.0

5.15

X Overall Size

 

D1

4.55

~

4.95

X Mold Cap Size

 

D2

3.15

3.3

3.45

X exposed Pad Size

 

E

4.85

5.0

5.15

Y Overall Size

 

E1

4.55

~

4.95

Y Mold Cap Size

 

E2

3.15

3.3

3.45

Y exposed Pad Size

 

L

0.30

~

0.50

Terminal Length

 

e

 

0.50 BSC

 

Terminal Pitch

 

b

0.18

0.25

0.30

Terminal Width

 

ccc

~

~

0.08

Coplanarity

 

Notes:

 

 

 

 

1.Controlling Unit: millimeter.

2.Dimension b applies to plated terminals and is measured between 0.15mm and 0.30mm from the terminal tip. Tolerance on the true position of the leads is ± 0.05 mm at maximum material conditions (MMC).

3.Details of terminal #1 identifier are optional but must be located within the zone indicated.

4.Coplanarity zone applies to exposed pad and terminals.

Revision 1.0 (04-15-09)

76

SMSC LAN8710/LAN8710i

 

DATASHEET