XR-M510
2525
Note on Printed Wiring Board:
•X: parts extracted from the component side.
•Y: parts extracted from the conductor side.
•: Pattern from the side which enables seeing.
(The other layers' patterns are not indicated.)
Caution:
Pattern face side: Parts on the pattern face side seen from
(Conductor Side) the pattern face are indicated.
Parts face side: Parts on the par ts face side seen from
(Component Side) the parts face are indicated.
7-5. NOTE FOR PRINTED WIRING BOARDS AND SCHEMATIC DIAGRAMS
Note on Schematic Diagram:
• All capacitors are in µF unless otherwise noted. pF: µµF
50 WV or less are not indicated except for electrolytics
and tantalums.
• All resistors are in Ω and 1/4 W or less unless otherwise
specified.
•f: internal component.
•C: panel designation.
•A: B+ Line.
•U: B+ Line.
•H: adjustment for repair.
• Po wer voltage is dc 14.4V and f ed with regulated dc power
supply from ACC and BATT cords.
• Voltages and waveforms are dc with respect to ground
under no-signal (detuned) conditions.
no mark : FM
( ) : MW
[]: LW
〈〈 〉〉 : TAPE PLA YBA CK
• V oltages are taken with a VOM (Input impedance 10 M Ω).
Voltage variations may be noted due to nor mal produc-
tion tolerances.
• Waveforms are taken with a oscilloscope.
Voltage variations may be noted due to nor mal produc-
tion tolerances.
• Circled numbers refer to waveforms.
• Signal path.
F: FM
f: MW/L W
L: BUS AUDIO IN
E: TAPE PLA Y
• Abbreviation
SE : South European model
• Please refer to servicing notes (page 3) for system of
TYPE A and B.
• Waveforms
– MAIN Board –
1IC700 5 OSCI
2IC601 ud X1A
3IC601 od X1
4IC607 ih EXTAL
– DISPLAY Board –
5IC901 oh OSC
2.4 Vp-p
231 ns
3.1 Vp-p
305 µs
3 Vp-p
54 ns
3.2 Vp-p
22.8 µs
3.2 Vp-p
22.8 µs
5.5 Vp-p
272 ns
6IC902 oh OSC
• DISPLAY board is four-layer printed board.
Howe ver , the patterns of layers 2 and 3 hav e not been included
in this diagrams.
• Abbreviation
SE : South European model
• Please refer to servicing notes (page 3) for system of TYPE A
and B.