3M™ Digital WallDisplay

Appendix

3M™ Digital WallDisplay Specifications

Display Size

 

 

 

60˝

Diagonal viewable area

 

 

 

 

 

 

 

 

Display Aspect Ratio

4:3

 

 

 

 

 

 

 

 

 

 

 

Display System

 

 

 

Single Chip, DLP™ Texas Instruments technology

 

 

 

 

 

 

 

 

DLP Chip

 

Chip Diagonal Size

 

 

0.7 inch

 

 

 

 

 

 

 

 

 

Number of Pixels

 

 

1024 x 768 pixels

 

 

 

 

 

 

 

 

 

 

 

 

Color

 

 

 

24-bit full color

 

 

 

 

 

 

 

 

Contrast Ratio

 

150:1

 

 

 

 

 

 

 

 

 

 

Lamp

 

Type

 

 

SHP (Super-High Pressure)

 

 

 

 

 

 

 

 

 

Life

 

 

 

 

 

 

 

 

 

16002

hoursuoH s

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Dimensions

 

 

 

47.6˝

H x 53.2˝ W x 7.0˝ D

 

 

 

(1208mm x 1350mm x 179mm)

 

 

 

 

 

 

 

 

 

 

 

 

 

Weight

 

 

 

Approx. 85 lbs.

 

 

 

 

 

 

 

Video Compatibility

 

 

NTSC, NTSC 4.43, PAL, PAL-N, PAL-M, SECAM

 

 

 

 

 

 

 

Computer Video Compatibility

 

 

VGA to SXGA

 

 

 

 

 

 

 

 

Mouse Emulation

 

 

 

PC serial mouse, ADB, and USB

 

 

 

 

 

 

 

 

 

 

 

 

 

Analog RGB: 15-pin mini D-Sub

 

 

Computer Input

 

 

 

 

 

 

 

 

 

 

Digital RGB: DVI-D (digital only)

 

 

Signals

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Audio: 3.5 mm stereo mini-jack

Input/Output

 

 

 

 

 

 

 

 

 

Video input signals

 

 

S-Video: Mini DIN 4-pin

Terminal

 

 

 

 

 

 

 

 

 

 

 

 

 

Audio Out

 

 

RCA jacks

 

 

 

 

 

 

 

 

 

 

RS-232 Control Port

 

 

9-pin D-Sub

 

 

 

 

 

 

 

 

 

 

Mouse Emulation Port

 

 

9-pin D-Sub

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Amplifier (to speakers)

 

 

20 Watts

Audio System

 

 

18

ppercchannelel

 

 

 

 

 

 

 

 

 

 

Speakers

 

 

40 Watts Max, 8 Ohms

 

 

 

 

 

 

 

 

 

 

 

Power Requirements

 

 

100~240 VAC, 50/60 Hz, 400 Watts Max.

 

 

 

 

 

 

 

 

 

48

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Texas Instruments 8200IW, 8200IC, 8100CB manual Appendix, 3M Digital WallDisplay Specifications

8200IW, 8100CB, 8200IC specifications

Texas Instruments (TI) has long been a leader in the semiconductor industry, developing a wide range of integrated circuits (ICs) that cater to various applications. Among these, the TI 8200IC, 8100CB, and 8200IW stand out for their innovative features and advanced technologies.

The Texas Instruments 8200IC is primarily designed for high-performance data processing applications. One of its standout features is its ability to operate at high speeds, making it ideal for demanding computing tasks. This IC supports a broad range of input voltages, ensuring compatibility with various systems. Its low power consumption is another critical advantage, as it allows for longer battery life in portable devices. Embedded within the 8200IC are advanced signal processing capabilities, which enable efficient handling of complex algorithms and data streams. This feature is essential in applications ranging from telecommunications to consumer electronics.

The TI 8100CB, on the other hand, focuses on microcontroller functionality, offering a versatile solution for embedded systems. This chip comes with an extensive selection of I/O ports, allowing seamless integration with other components in a system. Its built-in memory facilitates the execution of intricate control algorithms, making it suitable for automation and robotics applications. The 8100CB also supports multiple communication protocols, including Serial Peripheral Interface (SPI) and Inter-Integrated Circuit (I2C), enabling easy connectivity with sensors and peripherals. Moreover, its robust design ensures reliability in various operating conditions, making it a preferred choice for industrial and automotive applications.

Finally, the Texas Instruments 8200IW is designed with wireless communication in mind. This IC excels in providing reliable connectivity solutions, supporting multiple wireless protocols such as Bluetooth and Wi-Fi. Its compact design enables integration into space-constrained devices while maintaining high performance. The 8200IW features advanced security mechanisms to ensure data integrity during wireless transmission, which is critical in today’s connected world. Additionally, its energy-efficient architecture is tailored for IoT applications, allowing devices to operate efficiently in low-power modes.

In summary, the Texas Instruments 8200IC, 8100CB, and 8200IW showcase the company’s commitment to innovation in semiconductor technology. With features tailored for high-speed data processing, microcontroller applications, and wireless communication, these ICs offer versatile solutions for a wide array of uses, empowering designers to create cutting-edge products across different sectors.