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Texas Instruments APA100 manual 2.1.4PCB Layers, 3. Top Copper and Silkscreen

Models: APA100

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2.1.4PCB Layers

PCB Layout

3)Use a split ground plane to keep high switching ground currents from the operational amplifier circuitry.

4)Place decoupling capacitors close to the TLV2464A and TPA2001D1

5)Place RC filter capacitors (C20, C23, and C24) close to the operational amplifier, with capacitor grounds connecting with a low−impedance path to the operational amplifier ground pin.

6)Place RC filters (R8, R10, C8, and C11) close to the TPA2001D1, with capacitor grounds connecting with a low−impedance path to the TPA2001D1 AGND pin.

7)Place resistor R13 and capacitor C18 close to the TPA2001D1 inputs.

8)Connect the ground side of the TPA2001D1 ROSC, COSC, VDD, and BYPASS components to TPA2001D1 AGND before connecting to the rest of the ground plane.

2.1.4PCB Layers

The APA100 EVM board is constructed on a two-layer printed−circuit board using a copper-clad FR-4 laminate material. The printed−circuit board has a dimension of 3.4 inch (86,36 mm) X 2.5 inch (63,5 mm), and the board thickness is 0.062 inch (1,57 mm). Figure 2−3 through NO TAG show the individual artwork layers.

Figure 2−3. Top Copper and Silkscreen

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Texas Instruments APA100 manual 2.1.4PCB Layers, 3. Top Copper and Silkscreen

Contents

APA100 Audio Power AmplifiersUser’s Guide AugustApplications IMPORTANT NOTICEProducts About This Manual How to Use This ManualRead This First Information About Cautions and WarningsData Sheets Related Documentation From Texas InstrumentsFCC Warning This is an example of a warning statementContents Figures TablesPage EVM OverviewChapter Topic1.2.1Supply Voltage 1.1 Features1.2 Power Requirements EVM Overview 1.3 EVM Basic Function/Block DiagramEVM Basic Function/Block Diagram Integrator EVM Basic Function/Block DiagramFeedback TLV2464Chapter PCB DesignSchematic Page2.1 PCB Layout 2.1.1Split Ground PlaneFigure 2−2. APA100 Split Plane Bottom Layout 2.1.2H-BridgeLayout2.1.3Analog Section Layout 2.1.4PCB Layers Figure 2−3. Top Copper and SilkscreenPCB Layout Figure 2−4. Bottom Copper and SilkscreenFigure 2−5. Drill Drawing PCB DesignBill of Materials 2.2 Bill of MaterialsTable 2−1. Parts List PCB Design 2.3 SchematicSchematic Page Page EVM OperationChapter Topic3.1 Quick Start Figure 3−1. Quick Start Module Map3.4 Error Signals 3.2 Power−Up/Down Sequence3.3 Reset Button/Mute Table 3−1. TAS5111 Error Decoding3.5 Changing the Gain Page Technical InformationChapter Topic4.1 Feedback System Design Figure 4−1. APA100 Block DiagramPhase Margin + 180 Phase at Fc Figure 4−4. APA100 Integrator Design Closed−loop gain + 1.5 0 C10 V1 1 0 4.2 TPA2001D1 Class-DModulator Ch1: 3V/Div Ch2: 3V/Div Ch3: 3V/Div Ch4: 1V/Div Figure 4−7. TPA2001D1 Block DiagramTPA2001D1 Class-DModulator t − Time −4.4 TLV2464A Gain Setting and Feedback 4.3 TAS5111 H-Bridge4.5 LC Filter Figure 4−9. APA100 Output Filter4.6 Thermal Table 4−1. TAS5111 Thermal TableAs an indication of the importance of keeping the thermal grease layer thin, if the thermal grease layer increases to 0.002 inch thick, the required heatsink thermal resistance changes to 2.4C/W Page Measured ResultsChapter Topic5.1 Total Harmonic Distortion + Noise Total Harmonic Distortion + NoiseTotal Harmonic Distortion + Noise Measured Results5.2 Output Power Output PowerMeasured Results 5.3 EfficiencyEfficiency Gain and Phase Response 5.4 Gain and Phase Response5.5 Signal-to-NoiseRatio SNR Measured Results 5.6 Supply Ripple RejectionSupply Ripple Rejection