AR-B1375/AR-B1376 User s Guide

8. SPECIFICATIONS & SSD TYPES SUPPORTED

8.1 SPECIFICATIONS

CPU & Chipset:

ALI M6117, 33/40 MHz

Bus Interface:

ISA and PC/104 bus

DRAM:

Supports up to 32MB (two 72-pin SIMMs)

CRT/LCD Display:

1 MB RAM (1024X768/256 colors) with 10-pin and 44-pin header

HDC:

Supports two IDE type hard disk drives

FDC:

Supports two 5.25” or 3.5” floppy disk drives

Serial Port:

1 RS-232C port with DB-9 male connector

Parallel Port:

1 RS-232C/RS-485 with DB-9 male connector and 3-pin header

1 bi-directional centronics type parallel port

Keyboard:

PC/AT compatible keyboard with 6-pin mini-din connector

Speaker:

On-board Buzzer and external speaker with 4 pin header

Real Time Clock:

BQ3287MT or compatible chips

BIOS:

Legal flashed system and video BIOS

Watchdog:

Programmable watchdog timer

Solid State Disk:

1.5MB/3MB Flash/SRAM/EPROM disk (3 sockets)

DMA Channels:

7 DMA channels

Interrupt Levels:

15 vectored interrupt levels

Bus Speed:

7.159MHz

LED Indicator:

Power LED, hard disk LED, and watchdog LED

Power Connector:

One 8-pin (2.5mm) power connector

Power Req.:

+5V, 1.2A maximum (1 A maximum on AR-B1375)

Operating Temp.:

0 to 60 degree C. (140 degree F.)

Storage Temp.:

-25 to 85 degree C.

Humidity:

0 to 95% (non-condensing)

PC Board:

6 layers

Dimensions:

185 mmX122mm (7.29”X4.80”)

Weight:

AR-B1375 –260g (w/o memory chips & DRAM SIMMs)

 

AR-B1376 --285g (w/o memory chips & DRAM SIMMs)

8.2 SSD TYPES SUPPORTED

The following list contains SRAMs supported by the AR-B1375/AR-B1376:

AKM

AKM628128

(128Kx8, 1M bits)

HITACHI

HM628128

(128Kx8, 1M bits)

NEC

UPD431000A

(128Kx8, 1M bits)

SONY

CXK581000P/M

(128Kx8, 1M bits)

HITACHI

HM628512

(512Kx8, 4M bits)

NEC

UPD434000

(512Kx8, 4M bits)

SONY

CXK584000P/M

(512Kx8, 4M bits)

The following list contains large page 5V FLASHs supported by the AR-B1375/AR-B1376:

AMD

Am29F512

(64Kx8, 512K bits)

AMD

Am29F010

(128Kx8, 1M bits)

AMD

Am29F020

(256Kx8, 2M bits)

AMD

Am29F040

(512Kx8, 4M bits)

8-1

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Toshiba AR-B1375, AR-B1376, 386SX manual Specifications & SSD Types Supported

386SX, AR-B1376, AR-B1375 specifications

The Toshiba AR-B1375 and AR-B1376 are notable embedded computing solutions that incorporate the 386SX microprocessor architecture. Designed for various applications, these models focus on reliability, performance, and versatility, making them appealing choices for system integrators and developers.

At the core of the AR-B1375 and AR-B1376 is the Intel 386SX microprocessor. This landmark processor marked a significant advancement in computing technology, introducing a 32-bit architecture while maintaining compatibility with 16-bit applications. The 386SX is known for its efficient processing capabilities, offering both multitasking support and enhanced memory management. It operates at clock speeds ranging typically from 16 MHz to 25 MHz, contributing to its effectiveness in running industrial applications.

One of the key features of the AR-B1375 and AR-B1376 systems is their modular architecture, which allows for easy customization and expansion. This modularity means users can tailor the hardware according to specific requirements, making it suitable for a wide range of applications such as automation, telecommunications, and embedded systems.

Both models support various I/O options, ensuring seamless integration with peripherals and external devices. They typically come equipped with serial and parallel ports, as well as support for modern interfaces like USB. The systems also feature onboard expansion slots, enabling the addition of further functionality, such as additional memory or specialized processing units.

In terms of memory, the AR-B1375 and AR-B1376 support a range of RAM configurations, allowing users to scale their systems based on the application demands. The inclusion of EPROM and EEPROM options also facilitates easy updates and programmability, which is crucial for embedded systems that often require firmware adjustments over time.

Moreover, these models are known for their robust thermal management features, which are essential in industrial environments where conditions can be harsh. This capability ensures stable performance and longevity, reducing the risk of system failures due to overheating or environmental factors.

To summarize, the Toshiba AR-B1375 and AR-B1376, coupled with the 386SX microprocessor, offer a blend of performance, flexibility, and reliability. Their modular design, extensive I/O support, and memory scalability make them ideal for a variety of embedded computing applications, placing them as commendable options in the world of industrial computing solutions. These systems not only exemplify Toshiba's commitment to innovation but also contribute significantly to the functionality of embedded technologies in a rapidly evolving industry.