AR-B1375/AR-B1376 User s Guide

0.6 ORGANIZATION

This information for users covers the following topics (see the Table of Contents for a detailed listing):

zChapter 1, “Overview,” provides an overview of the system features and packing list.

zChapter 2, “System Controller,” describes the major structure.

zChapter 3, “Setting Up the System,” describes how to adjust the jumper, and the connectors setting.

zChapter 4, “CRT/LCD Flat Panel Display”, describes the configuration and installation procedure using LCD and CRT display.

zChapter 5, “Installation,” describes the utility diskette using, solid-state disk’s writing protect function, and the watchdog timer.

zChapter 6, “Solid State Disk,” describes the various type SSD’s installation steps.

zChapter 7, “BIOS Console,” providing the BIOS options setting.

zChapter 8, Specifications & SSD Types Supported

zChapter 9, Using Memory Banks

zChapter 10, Placement & Dimensions

zChapter 11, Programming RS-485 & Index

0.7STATIC ELECTRICITY PRECAUTIONS

Before removing the board from its anti-static bag, read this section about static electricity precautions.

Static electricity is a constant danger to computer systems. The charge that can build up in your body may be more than sufficient to damage integrated circuits on any PC board. It is, therefore, important to observe basic precautions whenever you use or handle computer components. Although areas with humid climates are much less prone to static build-up, it is always best to safeguard against accidents may result in expensive repairs. The following measures should generally be sufficient to protect your equipment from static discharge:

•Touch a grounded metal object to discharge the static electricity in your body (or ideally, wear a grounded wrist strap).

•When unpacking and handling the board or other system component, place all materials on an antic static surface.

•Be careful not to touch the components on the board, especially the “golden finger” connectors on the bottom of every board.

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Toshiba AR-B1376, AR-B1375, 386SX manual Organization, Static Electricity Precautions
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386SX, AR-B1376, AR-B1375 specifications

The Toshiba AR-B1375 and AR-B1376 are notable embedded computing solutions that incorporate the 386SX microprocessor architecture. Designed for various applications, these models focus on reliability, performance, and versatility, making them appealing choices for system integrators and developers.

At the core of the AR-B1375 and AR-B1376 is the Intel 386SX microprocessor. This landmark processor marked a significant advancement in computing technology, introducing a 32-bit architecture while maintaining compatibility with 16-bit applications. The 386SX is known for its efficient processing capabilities, offering both multitasking support and enhanced memory management. It operates at clock speeds ranging typically from 16 MHz to 25 MHz, contributing to its effectiveness in running industrial applications.

One of the key features of the AR-B1375 and AR-B1376 systems is their modular architecture, which allows for easy customization and expansion. This modularity means users can tailor the hardware according to specific requirements, making it suitable for a wide range of applications such as automation, telecommunications, and embedded systems.

Both models support various I/O options, ensuring seamless integration with peripherals and external devices. They typically come equipped with serial and parallel ports, as well as support for modern interfaces like USB. The systems also feature onboard expansion slots, enabling the addition of further functionality, such as additional memory or specialized processing units.

In terms of memory, the AR-B1375 and AR-B1376 support a range of RAM configurations, allowing users to scale their systems based on the application demands. The inclusion of EPROM and EEPROM options also facilitates easy updates and programmability, which is crucial for embedded systems that often require firmware adjustments over time.

Moreover, these models are known for their robust thermal management features, which are essential in industrial environments where conditions can be harsh. This capability ensures stable performance and longevity, reducing the risk of system failures due to overheating or environmental factors.

To summarize, the Toshiba AR-B1375 and AR-B1376, coupled with the 386SX microprocessor, offer a blend of performance, flexibility, and reliability. Their modular design, extensive I/O support, and memory scalability make them ideal for a variety of embedded computing applications, placing them as commendable options in the world of industrial computing solutions. These systems not only exemplify Toshiba's commitment to innovation but also contribute significantly to the functionality of embedded technologies in a rapidly evolving industry.
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