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INSTALLATION

GROUND CONNECTIONS

The circuit breaker cell must be grounded in accordance with the requirements of the National Electrical Code, Article 250 or applicable local standards.

WARNING

Proper grounding connections must be made to the circuit breaker cell before incoming power is applied.

It is very important that the circuit breaker and its enclosure be adequately grounded to protect the operator from injury in the event of short circuits or other abnormal occurrences and to ensure that the metal parts of the equipment, other than live parts, remain at ground potential.

Fig. 13 Location of Ground Terminal

The ground terminal is located on the left rear of the cell frame as shown in Fig. 13. To make the ground connection, first remove the fastening M8 hex head bolt and crimp-on terminal (provided with the cell) and crimp the terminal to the end of the ground wire. Then, reattach the terminal (Fig. 14) using the same bolt previously removed and torque to 120-150 kgf-cm (9-11 ft-lb).

Fig. 14 Installation of Ground Wire

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Toshiba HV6FS-MLD instruction manual Ground Connections, Location of Ground Terminal

HV6FS-MLD specifications

The Toshiba HV6FS-MLD is a high-performance semiconductor designed for various applications such as inverters, power supplies, and automotive systems. This device is particularly noted for its efficiency and reliability in managing high voltage levels, making it an essential component in modern electronic systems.

One of the standout features of the HV6FS-MLD is its superior power handling capacity. Designed to accommodate high voltage operations, this device ensures minimal energy loss during the conversion and regulation processes. The incorporation of advanced materials contributes to its ability to withstand high temperatures without compromising performance, making it suitable for harsh environments.

Another key technology integrated into the HV6FS-MLD is Toshiba’s Isolated Gate Drive technology. This technology enhances the safety and stability of the device by preventing unwanted current flow, which is particularly crucial in high-voltage applications. The isolated gate drive also allows for better control and reliability when interfacing with different circuit topologies.

The HV6FS-MLD is characterized by its compact design, which enables it to fit into space-constrained environments without sacrificing power capabilities. This compactness does not impair its performance; rather, it ensures that devices are not only efficient but also adaptable to various designs. Furthermore, the device is equipped with integrated protection features, including over-voltage protection and thermal shutdown mechanisms, which safeguard both the HV6FS-MLD itself and the larger system in which it operates.

Moreover, the HV6FS-MLD supports a wide operating temperature range, making it versatile for applications ranging from consumer electronics to industrial systems. This adaptability is crucial as manufacturers increasingly demand components that can perform reliably across varying conditions.

Toshiba's commitment to quality and innovation is reflected in the HV6FS-MLD’s robust performance and longevity. The component’s reliability is further enhanced by rigorous testing protocols that ensure it meets stringent industry standards. As electronic systems continue to evolve, the HV6FS-MLD stands out as a dependable solution for powering the next generation of devices.

In conclusion, the Toshiba HV6FS-MLD is an advanced semiconductor solution that embodies efficiency, reliability, and versatility, making it an invaluable asset in the design and implementation of modern electronic systems.