Intel D865PCD specifications Overview, Feature Summary

Intel Desktop Board D865PCD Technical Product Specification

1.1 Overview

1.1.1Feature Summary

Table 1 summarizes the major features of the Desktop Board D865PCD.

Table 1. Feature Summary

Form Factor

Processor

Memory

Chipset

Video

Audio

I/O Control

USB

Peripheral

Interfaces

LAN Support

BIOS

Instantly Available PC Technology

Expansion

Capabilities

microATX (9.60 inches by 9.60 inches [243.84 millimeters by 243.84 millimeters])

•Support for an Intel® Pentium® 4 processor in an mPGA478 socket with a 400 or 533 MHz system bus

•Support for an Intel® Celeron® processor in an mPGA478 socket with a 400 MHz system bus

•Two 184-pin DDR SDRAM Dual Inline Memory Module (DIMM) sockets

•Support for DDR 333 and DDR 266 DIMMs

•Support for up to 2 GB of system memory

Intel® 865P Chipset, consisting of:

•Intel® 82865P Memory Controller Hub (MCH)

•Intel® 82801EB I/O Controller Hub (ICH5)

•4 Mbit Firmware Hub (FWH)

Universal 0.8 V / 1.5 V AGP 3.0 connector (with integrated retention mechanism) supporting 1x, 4x, and 8x AGP cards or an AGP Digital Display (ADD) card

Audio subsystem using the Realtek ALC202 codec

LPC Bus I/O controller

Support for USB 2.0 devices

•Six USB ports

•One serial port

•One parallel port

•Two Parallel ATA IDE interfaces with UDMA 33, ATA-66/100 support

•One diskette drive interface

•PS/2* keyboard and mouse ports

10/100 Mbits/sec LAN subsystem using the Intel® 82562EZ Platform LAN Connect (PLC) device

•Intel/AMI BIOS (resident in the 4 Mbit FWH)

•Support for Advanced Configuration and Power Interface (ACPI), Plug and Play, and SMBIOS

•Support for PCI Local Bus Specification Revision 2.2

•Suspend to RAM support

•Wake on PCI, RS-232, front panel, PS/2 devices, and USB ports

Three PCI bus add-in card connectors (SMBus routed to PCI bus connector 2)

For information about

Available configurations for the Desktop Boards D865PCD

The board’s compliance level with ACPI, Plug and Play, and SMBIOS

Refer to

Section 1.2, page 16

Section 1.3, page 16

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