Intel 317443-001US IMVP6, Inter-Symbol Interference, Media Expansion Card, Network, Overshoot

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IMVP6

Intel® 945GME Express Chipset—About This Manual

needed to ensure the setup time of the receiver. More precisely, flight time is defined as:

The time difference between a signal at the input pin of a receiving agent crossing the switching voltage (adjusted to meet the receiver manufacturer’s conditions required for AC timing specifications; i.e., ringback, etc.) and the output pin of the driving agent crossing the switching voltage when the driver is driving a test load used to specify the driver’s AC timings.

Maximum and Minimum Flight Time - Flight time variations are caused by many different parameters. The more obvious causes include variation of the board dielectric constant, changes in load condition, crosstalk, power noise, variation in termination resistance, and differences in I/O buffer performance as a function of temperature, voltage, and manufacturing process. Some less obvious causes include effects of Simultaneous Switching Output (SSO) and packaging effects.

Maximum flight time is the largest acceptable flight time a network will experience under all conditions.

Minimum flight time is the smallest acceptable flight time a network will experience under all conditions.

Infrared Data Assoc. The Infrared Data Association (IrDA) has outlined a specification for serial communication between two devices via a bi- directional infrared data port. The 945GME platform has such a port and it is located on the rear of the platform between the two USB connectors.

IMVP6

The Intel Mobile Voltage Positioning specification for the Intel®

 

Core™ 2 Duo Processor. It is a DC-DC converter module that

 

supplies the required voltage and current to a single processor.

Inter-Symbol Interference

Inter-symbol interference is the effect of a previous signal (or transition) on the interconnect delay. For example, when a signal is transmitted down a line and the reflections due to the transition have not completely dissipated, the following data transition launched onto the bus is affected. ISI is dependent upon frequency, time delay of the line, and the reflection coefficient at the driver and receiver. ISI may impact both timing and signal integrity.

Media Expansion Card

The Media Expansion Card (MEC) provides digital display options through the SDVO interface. The MEC card also incorporates video-in.

Network

The network is the trace of a Printed Circuit Board (PCB) that

 

completes an electrical connection between two or more

 

components.

Overshoot

The maximum voltage observed for a signal at the device pad,

 

measured with respect to VCC.

Pad

The electrical contact point of a semiconductor die to the

 

package substrate. A pad is only observable in simulations.

Pin

The contact point of a component package to the traces on a

 

substrate, such as the motherboard. Signal quality and timings

 

may be measured at the pin.

Intel® CoreTM 2 Duo processor with the Mobile Intel® 945GME Express Chipset

 

Manual

May 2007

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Order Number: 317443-001US

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Contents Development Kit User’s Manual Order Number 317443-001USManual Contents Figures TablesSATA Port 0 Power Connector Pinout J6H3 IDE Connector J7J1SATA Port 0 Data Connector Pinout J7H1 SATA Port 2 Mobile Drive Connector Pinout J8J2Revision History Intel 945GME Express Chipset-Revision History1.0 About This Manual 1.1 Content Overview1.2 Text Conventions Numbers Signal NamesInstructions Units of MeasureAnti-etch 1.3 Glossary of Terms and AcronymsAggressor Assisted Gunning Transceiver Logic+Media Expansion Card Inter-Symbol InterferenceIMVP6 NetworkAcronyms Sheet 1 of Power-GoodAcronyms Sheet 2 of Acronyms Sheet 3 of 1.4.1 Electronic Support Systems 1.4 Support Options1.5 Product Literature 1.4.2 Additional Technical SupportUpdate 1.6 Related DocumentsRelated Documents Mobile Intel 945 Express Chipset Family Datasheet2.0 Getting Started 2.1.1 Intel 945GME Express Chipset Development Kit Features2.1 Overview Miscellaneous Features Connector Interface SummaryDebug Features Clocking2.3 Software Key Features 2.3.1 AMI* BIOS2.2 Included Hardware and Documentation 2.4 Before You Begin cables to this product 2.5 Setting Up the Evaluation Boardused when handling the board remove any hardware unless the system is unplugged2.6 Configuring the BIOS Figure 1. Intel 945GME Express Chipset Development Kit Block Diagram 3.1 Block Diagram3.0 Theory of Operation 3.3 Thermal Management 3.4 System Features and Operation3.2 Mechanical Form Factor 3.4.1 IntelR 945GME GMCH3.4.1.2 DMI 3.4.2 ICH7-M3.4.1.1 System Memory 3.4.1.3 Advanced Graphics and Display Interface3.4.2.4 AC’97 and High Definition Audio 3.4.2.2 PCI Slots3.4.2.3 On-Board LAN 3.4.2.5 ATA / Storage3.4.2.7 LPC Super I/O SIO/LPC Slot 3.4.2.6 USB Connectors3.4.2.9 BIOS Firmware Hub FWH 3.4.2.8 Serial, IrDA3.4.2.12 Real Time Clock 3.4.3 System I/O and Connector Summary3.4.2.11 Clocks 3.4.2.13 Thermal Monitoring3.4.3.2 SATA Support 3.4.3.5 VGA Connector3.4.3.1 PCI Express* Support 3.4.3.3 IDE Support3.5 Clock Generation 3.4.3.7 32 bit/33 MHz PCI Connectors3.4.3.8 Ethernet Gigabit LAN Interface connector 3.4.4 POST Code Debugger3.6 Power Management States 3.6.2 Transition to S4 3.7 Power Measurement Support3.6.1 Transition to S3 3.6.3 Transition to S5V is the voltage measured across the sense resistor Powered duringR is the value of the sense resistor typically 0.002 Ω Voltage GroupsTheory of Operation-Intel 945GME Express Chipset Intel 945GME Express Chipset-Theory of Operation 4.1 Primary Features 4.0 Hardware ReferenceReference Default SettingIntel 945GME Express Chipset-Hardware Reference DesignatorHardware Reference-Intel 945GME Express Chipset 4.2 Back Panel Connectors 4.3 Configuration Settings Supported Configuration Jumper/Switch Settings Sheet 1 of Supported Configuration Jumper/Switch Settings Sheet 2 of 4.4 Power On and Reset Buttons 4.6.1 H8 Programming Headers 4.5 LEDs4.6 Other Headers, Slots, and Sockets Table 9. Intel 945GME Express Chipset LED Function LegendH8 Programming Jumpers 4.6.2 Expansion Slots and Sockets4.6.2.1 478 Pin Grid Array Micro-FCPGA Socket Expansion Slots and Sockets4.6.2.2 PCI Express PCI Express* x16 Pinout J6C1 Sheet 1 ofPCI Express* x16 Pinout J6C1 Sheet 2 of Table 12. PCI Express* x16 Pinout J6C1 Sheet 3 of 4.6.2.3 Media Expansion Card MEC SlotMEC Slot J6C1 Sheet 1 of MEC Slot J6C1 Sheet 2 of Intel 945GME Express Chipset-Hardware ReferenceMEC Slot J6C1 Sheet 3 of 4.6.2.4 PCI ExpressPCI Express* x1 Pinout J7C1, J8C1 Sheet 1 of Table 14. PCI Express* x1 Pinout J7C1, J8C1 Sheet 2 of Table 16. SATA Port 0 Data Connector Pinout J7H1 4.6.2.5 IDE ConnectorIDE Connector J7J1 4.6.2.6 SATA PinoutTable 18. SATA Port 2 Mobile Drive Connector Pinout J8J2 4.6.2.7 Fan ConnectorsTable 17. SATA Port 0 Power Connector Pinout J6H3 Table 19. Fan Connectors J3F1 and J3C1Appendix A Heat Sink Installation Instructions Figure 6. Heatsink and BackplateFigure 7. Backplate Pins Intel 945GME Express Chipset-Heat Sink Installation InstructionsFigure 8. Applying the Thermal Grease Figure 9. Squeezing Activation ArmFigure 10. Installing the Heatsink Figure 11. Plugging in the Fan Figure 12. Completed Assembly