Intel® 945GME Express
needed to ensure the setup time of the receiver. More precisely, flight time is defined as:
•The time difference between a signal at the input pin of a receiving agent crossing the switching voltage (adjusted to meet the receiver manufacturer’s conditions required for AC timing specifications; i.e., ringback, etc.) and the output pin of the driving agent crossing the switching voltage when the driver is driving a test load used to specify the driver’s AC timings.
•Maximum and Minimum Flight Time - Flight time variations are caused by many different parameters. The more obvious causes include variation of the board dielectric constant, changes in load condition, crosstalk, power noise, variation in termination resistance, and differences in I/O buffer performance as a function of temperature, voltage, and manufacturing process. Some less obvious causes include effects of Simultaneous Switching Output (SSO) and packaging effects.
•Maximum flight time is the largest acceptable flight time a network will experience under all conditions.
•Minimum flight time is the smallest acceptable flight time a network will experience under all conditions.
Infrared Data Assoc. The Infrared Data Association (IrDA) has outlined a specification for serial communication between two devices via a bi- directional infrared data port. The 945GME platform has such a port and it is located on the rear of the platform between the two USB connectors.
IMVP6 | The Intel Mobile Voltage Positioning specification for the Intel® |
| Core™ 2 Duo Processor. It is a |
| supplies the required voltage and current to a single processor. |
Inter-Symbol Interference
Media Expansion Card
The Media Expansion Card (MEC) provides digital display options through the SDVO interface. The MEC card also incorporates
Network | The network is the trace of a Printed Circuit Board (PCB) that |
| completes an electrical connection between two or more |
| components. |
Overshoot | The maximum voltage observed for a signal at the device pad, |
| measured with respect to VCC. |
Pad | The electrical contact point of a semiconductor die to the |
| package substrate. A pad is only observable in simulations. |
Pin | The contact point of a component package to the traces on a |
| substrate, such as the motherboard. Signal quality and timings |
| may be measured at the pin. |
Intel® CoreTM 2 Duo processor with the Mobile Intel® 945GME Express Chipset |
|
Manual | May 2007 |
10 | Order Number: |