Intel 317443-001US System I/O and Connector Summary, Clocks, Real Time Clock, Thermal Monitoring

Theory of Operation—Intel®945GME Express Chipset

3.4.2.11Clocks

The Intel® 945GME Express Chipset board uses a CK-410M and CK-SSCD compatible solution. The CK-SSCD solution offers improved EMI performance by spreading the radiated clock emissions over a wider spectrum than a single frequency. This is accomplished while controlling the clock frequency deviation such that system performance is not compromised. The FSB frequency is determined from decoding the processor BSEL[2:0] pin settings.

3.4.2.12Real Time Clock

An on-board battery at BT5H1 maintains power to the real time clock (RTC) when in a mechanical off state. A CR2032 battery is installed on the Intel® 945GME Express Chipset development kit.

3.4.2.13Thermal Monitoring

The processor has a thermal diode for temperature monitoring. The SMC thermal monitoring device will throttle the processor if it becomes hot. If the temperature of the processor rises too high, the SMC will alternately blink the CAPS lock and NUM lock LEDs on the board, and the board will shut down.

3.4.3System I/O and Connector Summary

The evaluation board provides extensive I/O capability in the form of internal connectors and headers as detailed by the following list. For detailed information on these connectors and headers, please refer to “Hardware Reference” on page 35.

•One (x16) PCI Express* connector

•Two (x1) PCI Express* connectors

•Two PCI connectors

•One IDE connector (supports two drives)

•Two SATA connectors

•Two USB ports via front panel header (J8J1)

•One LVDS video connector

	Intel® CoreTM 2 Duo processor with the Mobile Intel® 945GME Express Chipset
May 2007	Manual
Order Number: 317443-001US	27