Increasing Microprocessor Speed
Figure 5–1 Fan/Heat-Sink Assembly
Airflow
Screw,
Torque to 3 ±1
Fan
Clip,
Nut, Hex,
Aluminum
Flats, Qty 2
Torque to15 ±2
Heat Sink, with Fan Mounting Holes
Thermal Pad
Alpha 21164PC
a.Put the GRAFOIL thermal pad in place. The GRAFOIL pad is used to improve the thermal conductivity between the chip package and the heat sink by replacing micro air pockets with a less insulative material. Perform the following steps to position the GRAFOIL pad:
1.Perform a visual inspection of the package slug to ensure that it is free of contamination.
2.Wearing clean gloves, pick up the GRAFOIL pad. Do not perform this with bare hands because skin oils can be transferred to the pad.
3.Place the GRAFOIL pad on the
Memory and Microprocessor Configuration