TPS54810 | www.ti.com |
SLVS420B − MARCH 2002 − R EVISED FEBRUARY 2005
These devices have limited
ORDERING INFORMATION
TA | OUTPUT VOLTAGE | PACKAGE | PART NUMBER |
−40°C to 85°C | 0.9 V to 3.3 V | PLASTIC HTSSOP (PWP)(1) | TPS54810PWP |
(1)The PWP package is also available taped and reeled. Add an R suffix to the device type (i.e., TPS54810PWPR). See the application section of the data sheet for PowerPAD™ drawing and layout information.
(2)For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI website at www.ti.com.
ABSOLUTE MAXIMUM RATINGS
over operating
TPS54810
UNIT
| VIN, SS/ENA, SYNC | −0.3 to 7 |
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Input voltage range, VI | RT | −0.3 to 6 |
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VSENSE | −0.3 to 4 |
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| BOOT | −0.3 to 17 |
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Output voltage range, VO | VBIAS, COMP, PWRGD | −0.3 to 7 |
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PH | −0.6 to 10 |
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Source current, IO | PH | Internally | Limited | |
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COMP, VBIAS | 6 |
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| PH | 12 |
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Sink current, IS | COMP | 6 |
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| SS/ENA, PWRGD | 10 |
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Voltage differential | AGND to PGND | ±0.3 |
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Operating virtual junction temperature range, TJ |
| −40 to 125 |
| °C |
Storage temperature, Tstg |
| −65 to 150 |
| °C |
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds | 300 |
| °C |
(1)Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to
RECOMMENDED OPERATING CONDITIONS
| MIN | NOM MAX | UNIT |
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Input voltage range, VI | 4 | 6 | V |
Operating junction temperature, TJ | −40 | 125 | °C |
DISSIPATION RATINGS(1) (2)
PACKAGE | THERMAL IMPEDANCE | TA ≤ 25°C | TA = 70°C | TA = 85°C | |
| POWER RATING | POWER RATING | POWER RATING | ||
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18.2 °C/W | 5.49 W(2) | 3.02 W | 2.20 W | ||
40.5 °C/W | 2.48 W | 1.36 W | 0.99 W | ||
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(1)For more information on the PWP package, refer to TI technical brief, literature number SLMA002.
(2)Test Board Conditions:
1.3” x 3”, 4 layers, thickness: 0.062”
2.1.5 oz. copper traces located on the top of the PCB
3.1.5 oz. copper ground plane on the bottom of the PCB
4.0.5 oz. copper ground planes on the 2 internal layers
5.12 thermal vias (see “Recommended Land Pattern” in applications section of this data sheet)
(3)Maximum power dissipation may be limited by over current protection.
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