Cypress CY62136EV30 Thermal Resistance8, AC Test Loads and Waveforms, Data Retention Waveform

CY62136EV30

MoBL®

Thermal Resistance[8]

Parameter	Description	Test Conditions	VFBGA	TSOP II	Unit
			Package	Package
ΘJA	Thermal Resistance	Still Air, soldered on a 3 × 4.5 inch, two-layer	75	77	°C/W
	(Junction to Ambient)[8]	printed circuit board
ΘJC	Thermal Resistance		10	13	°C/W
	(Junction to Case)[8]

AC Test Loads and Waveforms

R1

VCC

OUTPUT

30 pF

INCLUDING

JIG AND

SCOPE

	VCC		ALL INPUT PULSES
					90%
		10%	90%			10%
R2	GND
	Rise Time = 1	V/ns				Fall Time = 1 V/ns
	Equivalent to: THÉVENIN EQUIVALENT
		OUTPUT		RTH			VTH

Parameters	2.50V	3.0V	Unit
R1	16667	1103	Ω
R2	15385	1554	Ω
RTH	8000	645	Ω
VTH	1.20	1.75	V

Data Retention Characteristics (Over the Operating Range)[8, 9]

Parameter	Description	Conditions	Min.	Typ.[4]	Max.	Unit
VDR	VCC for Data Retention		1.0			V
ICCDR	Data Retention Current	VCC= 1.0V		0.8	3	∝A
		CE > VCC – 0.2V,
		VIN > VCC – 0.2V or VIN < 0.2V
tCDR[8]	Chip Deselect to Data		0			ns
	Retention Time
t [9]	Operation Recovery		t			ns
R	Time		RC

Data Retention Waveform

	VCC(min)	DATA RETENTION MODE	VCC(min)
VCC		VDR > 1.0 V
	tCDR		tR
CE

Notes:

9. Full device operation requires linear VCC ramp from VDR to VCC(min.) > 100 ∝s or stable at VCC(min.) > 100 ∝s.

Document #: 38-05569 Rev. *B Page 4 of 12

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