Cypress CY62137EV30 Thermal Resistance, AC Test Loads and Waveforms, Data Retention Waveform10

CY62137EV30

MoBL®

Capacitance (for all packages)[8]

Parameter			Description		Test Conditions		Max.		Unit
CIN		Input Capacitance			TA = 25°C, f = 1 MHz,	10			pF
					VCC = VCC(typ)
COUT		Output Capacitance				10			pF
Thermal Resistance
Parameter	Description				Test Conditions		BGA	TSOP II		Unit
ΘJA	Thermal Resistance			Still Air, soldered on a 3 × 4.5 inch, two-layer			75	77		°C/W
	(Junction to Ambient)[8]			printed circuit board
ΘJC	Thermal Resistance						10	13		°C/W
	(Junction to Case)[8]

AC Test Loads and Waveforms

R1

VCC

OUTPUT

30 pF

INCLUDING JIG AND SCOPE

	VCC		ALL INPUT PULSES
					90%
		10%	90%			10%
R2	GND
	Rise Time = 1 V/ns					Fall Time = 1 V/ns
	Equivalent to: THÉVENIN EQUIVALENT
				RTH
		OUTPUT					V

Parameters	2.50V	3.0V	Unit
R1	16667	1103	Ω
R2	15385	1554	Ω
RTH	8000	645	Ω
VTH	1.20	1.75	V

Data Retention Characteristics (Over the Operating Range)

Parameter	Description	Conditions	Min.	Typ.[7]	Max.	Unit
VDR	VCC for Data Retention		1			V
ICCDR	Data Retention Current	VCC= 1V		0.8	3	∝A
		CE > VCC – 0.2V,
		VIN > VCC – 0.2V or VIN < 0.2V
tCDR[8]	Chip Deselect to Data		0			ns
	Retention Time
t [9]	Operation Recovery Time		t			ns
R			RC

Data Retention Waveform[10]

	VCC(min)	DATA RETENTION MODE	VCC(min)
VCC		VDR > 1.5V
CE or	tCDR		tR
BHE.BLE

Notes:

8.Tested initially and after any design or process changes that may affect these parameters.

9.Full device operation requires linear VCC ramp from VDR to VCC(min.) > 100 ∝s or stable at VCC(min.) > 100 ∝s.

Document #: 38-05443 Rev. *B Page 4 of 12

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