CY7C1365C
Package Diagram
100-Pin TQFP (14 x 20 x 1.4 mm) (51-85050)
22.00±0.20
R 0.08 MIN. 0.20 MAX.
0.25
| 16.00±0.20 |
| 14.00±0.10 |
100 | 81 |
1 | 80 |
0.30±0.08
20.00±0.10
0.65
TYP.
30 |
|
| 51 |
|
| ||
31 | 50 |
0° MIN.
12° ±1° (8X)
SEATING PLANE
NOTE:
1.40±0.05
SEE DETAIL | A |
0.20 MAX.
1.60 MAX.
0.10
GAUGE PLANE
0°
0.60±0.15
R 0.08 MIN. 0.20 MAX.
1.JEDEC STD REF MS-026
2.BODY LENGTH DIMENSION DOES NOT INCLUDE MOLD PROTRUSION/END FLASH MOLD PROTRUSION/END FLASH SHALL NOT EXCEED 0.0098 in (0.25 mm) PER SIDE BODY LENGTH DIMENSIONS ARE MAX PLASTIC BODY SIZE INCLUDING MOLD MISMATCH
3.DIMENSIONS IN MILLIMETERS
1.00 REF.
0.20 MIN. | |
|
DETAIL A
Intel and Pentium are registered trademarks and i486 is a trademark of Intel Corporation. All product and company names mentioned in this document may be the trademarks of their respective holders.
Document #: | Page 17 of 18 |
© Cypress Semiconductor Corporation, 2006. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use of any circuitry other than circuitry embodied in a Cypress product. Nor does it convey or imply any license under patent or other rights. Cypress products are not warranted nor intended to be used for medical, life support, life saving, critical control or safety applications, unless pursuant to an express written agreement with Cypress. Furthermore, Cypress does not authorize its products for use as critical components in
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