Cypress CY7C1520AV18 Application Example, Depth Expansion, Programmable Impedance, Echo Clocks

CY7C1516AV18, CY7C1527AV18 CY7C1518AV18, CY7C1520AV18

current data. The SRAM does this by bypassing the memory array and reading the data from the registers.

Depth Expansion

Depth expansion requires replicating the LD control signal for each bank. All other control signals can be common between banks as appropriate.

Programmable Impedance

An external resistor, RQ, must be connected between the ZQ pin on the SRAM and VSS to allow the SRAM to adjust its output driver impedance. The value of RQ must be 5x the value of the intended line impedance driven by the SRAM. The allowable range of RQ to guarantee impedance matching with a tolerance of ±15% is between 175Ω and 350Ω, with VDDQ = 1.5V. The output impedance is adjusted every 1024 cycles upon power up to account for drifts in supply voltage and temperature.

Echo Clocks

Echo clocks are provided on the DDR-II to simplify data capture on high-speed systems. Two echo clocks are generated by the

DDR-II. CQ is referenced with respect to C and CQ is referenced with respect to C. These are free-running clocks and are synchronized to the output clock of the DDR-II. In single clock mode, CQ is generated with respect to K and CQ is generated with respect to K. The timing for the echo clocks is shown in the Switching Characteristics on page 23.

DLL

These chips use a DLL that is designed to function between 120 MHz and the specified maximum clock frequency. During power up, when the DOFF is tied HIGH, the DLL is locked after 1024 cycles of stable clock. The DLL can also be reset by slowing or stopping the input clock K and K for a minimum of 30 ns. However, it is not necessary to reset the DLL to lock to the desired frequency. The DLL automatically locks 1024 clock cycles after a stable clock is presented. The DLL may be disabled by applying ground to the DOFF pin. When the DLL is turned off, the device behaves in DDR-I mode (with one cycle latency and a longer access time). For information refer to the application note DLL Considerations in QDRII™/DDRII.

Application Example

Figure 1 shows two DDR-II used in an application.

Figure 1. Application Example

SRAM#1 ZQ

DQCQ/CQ#

A LD# R/W# C C# K K#

	DQ
BUS	Addresses
MASTER	Cycle Start#
(CPU	R/W#
or	Return CLK	Vterm = 0.75V
ASIC)	Source CLK
		R = 50ohms
	Return CLK#
		Vterm = 0.75V
	Source CLK#
Echo Clock1/Echo Clock#1
Echo Clock2/Echo Clock#2

R = 250ohms	SRAM#2		ZQ
	DQ	CQ/CQ#
	A LD# R/W# C C#	K K#

R = 250ohms

Document Number: 001-06982 Rev. *D Page 9 of 30

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