Cypress CY7C1520AV18 manual Features, Functional Description, Configurations, Selection Guide

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CY7C1516AV18, CY7C1527AV18 CY7C1518AV18, CY7C1520AV18

72-Mbit DDR-II SRAM 2-Word Burst Architecture

Features

72-Mbit density (8M x 8, 8M x 9, 4M x 18, 2M x 36)

300 MHz clock for high bandwidth

2-word burst for reducing address bus frequency

Double Data Rate (DDR) interfaces

(data transferred at 600 MHz) at 300 MHz

Two input clocks (K and K) for precise DDR timing SRAM uses rising edges only

Two input clocks for output data (C and C) to minimize clock skew and flight time mismatches

Echo clocks (CQ and CQ) simplify data capture in high-speed systems

Synchronous internally self-timed writes

DDR-II operates with 1.5 cycle read latency when Delay Lock Loop (DLL) is enabled

Operates as a DDR-I device with 1 cycle read latency in DLL off mode

1.8V core power supply with HSTL inputs and outputs

Variable drive HSTL output buffers

Expanded HSTL output voltage (1.4V–VDD)

Available in 165-Ball FBGA package (15 x 17 x 1.4 mm)

Offered in both Pb-free and non Pb-free packages

JTAG 1149.1 compatible test access port

Delay Lock Loop (DLL) for accurate data placement

Functional Description

The CY7C1516AV18, CY7C1527AV18, CY7C1518AV18, and CY7C1520AV18 are 1.8V Synchronous Pipelined SRAM equipped with DDR-II architecture. The DDR-II consists of an SRAM core with advanced synchronous peripheral circuitry and a 1-bit burst counter. Addresses for read and write are latched on alternate rising edges of the input (K) clock. Write data is registered on the rising edges of both K and K. Read data is driven on the rising edges of C and C if provided, or on the rising edge of K and K if C/C are not provided. Each address location is associated with two 8-bit words in the case of CY7C1516AV18 and two 9-bit words in the case of CY7C1527AV18 that burst sequentially into or out of the device. The burst counter always starts with a “0” internally in the case of CY7C1516AV18 and CY7C1527AV18. On CY7C1518AV18 and CY7C1520AV18, the burst counter takes in the least significant bit of the external address and bursts two 18-bit words in the case of CY7C1518AV18 and two 36-bit words in the case of CY7C1520AV18 sequentially into or out of the device.

Asynchronous inputs include an output impedance matching input (ZQ). Synchronous data outputs (Q, sharing the same physical pins as the data inputs D) are tightly matched to the two output echo clocks CQ/CQ, eliminating the need for separately capturing data from each individual DDR SRAM in the system design. Output data clocks (C/C) enable maximum system clocking and data synchronization flexibility.

All synchronous inputs pass through input registers controlled by the K or K input clocks. All data outputs pass through output registers controlled by the C or C (or K or K in a single clock domain) input clocks. Writes are conducted with on-chip synchronous self-timed write circuitry.

Configurations

CY7C1516AV18 – 8M x 8 CY7C1527AV18 – 8M x 9 CY7C1518AV18 – 4M x 18 CY7C1520AV18 – 2M x 36

Selection Guide

Description

300 MHz

278 MHz

250 MHz

200 MHz

167 MHz

Unit

Maximum Operating Frequency

 

300

278

250

200

167

MHz

Maximum Operating Current

x8

900

860

800

700

650

mA

 

 

 

 

 

 

 

 

 

x9

900

860

800

700

650

 

 

 

 

 

 

 

 

 

 

x18

940

860

800

700

650

 

 

 

 

 

 

 

 

 

 

x36

1080

985

900

735

650

 

 

 

 

 

 

 

 

 

Cypress Semiconductor Corporation • 198 Champion Court

San Jose, CA 95134-1709

408-943-2600

Document Number: 001-06982 Rev. *D

 

 

Revised June 16, 2008

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Contents Configurations FeaturesFunctional Description Selection GuideLogic Block Diagram CY7C1527AV18 Logic Block Diagram CY7C1516AV18Doff CLKLogic Block Diagram CY7C1520AV18 Logic Block Diagram CY7C1518AV18BWS Ball Fbga 15 x 17 x 1.4 mm Pinout Pin ConfigurationCY7C1516AV18 8M x CY7C1527AV18 8M xCY7C1520AV18 2M x CY7C1518AV18 4M xPin Name Pin Description Pin DefinitionsSynchronous Read or Write input. When Power Supply Inputs for the Outputs of the Device Power supply Inputs to the Core of the DeviceTDO for Jtag TCK Pin for JtagFunctional Overview Single Clock ModeDDR Operation Depth Expansion Application ExampleProgrammable Impedance Echo ClocksOperation Write Cycle DescriptionsFirst Address External Second Address Internal BWS0/ BWS1 NWS0 NWS1BWS0 BWS1 BWS2 BWS3 BWS0Ieee 1149.1 Serial Boundary Scan Jtag Idcode TAP Controller State Diagram TAP Electrical Characteristics TAP Controller Block DiagramTDI TCKTAP Timing and Test Conditions TAP AC Switching CharacteristicsScan Register Sizes Identification Register DefinitionsInstruction Codes Register Name Bit SizeBit # Bump ID Boundary Scan OrderPower Up Sequence Power Up Sequence in DDR-II SramDLL Constraints DC Electrical Characteristics Electrical CharacteristicsMaximum Ratings AC Electrical Characteristics Thermal Resistance CapacitanceParameter Description Test Conditions Max Unit Parameter Description Test Conditions Fbga UnitSwitching Characteristics DLL Timing Static to DLL ResetNOP Switching WaveformsRead NOP Write ReadOrdering Information 250 167 Ball Fbga 15 x 17 x 1.4 mm Package DiagramWorldwide Sales and Design Support Products PSoC Solutions Sales, Solutions, and Legal InformationREV ECN no Submission ORIG. Description of Change Date