Cypress CY7C68000A PCB Layout Recommendations, Vfbga 5 x 5 x 1.0 mm 0.50 Pitch, 0.30 Ball BZ56

CY7C68000A

Package Diagrams (continued)

Figure 7. 56 VFBGA (5 x 5 x 1.0 mm) 0.50 Pitch, 0.30 Ball BZ56

TOP VIEW

	PIN A1 CORNER
	1	2	3	4	5	6	6	8
	A
	B
5.00±0.10	C
	D
	E
	F
	G

BOTTOM VIEW

Ø0.05 M C
Ø0.15 M C A	B	A1 CORNER
Ø0.30±0.05(56X)

		8	7	6	5	4	3	2	1
									A
		0.50							B
5.00±0.10	3.50								C
									D
									E
									F
									G

H

5.00±0.10

-B-

-A-

H

0.50

3.50

5.00±0.10

	SIDE VIEW	C
		0.10
0.45			0.080 C
-C-	SEATING PLANE
0.21		~0.260	1.0 max
		0.160

0.10(4X)

REFERENCE JEDEC: MO-195C

PACKAGE WEIGHT: 0.02 grams

001-03901-*B

PCB Layout Recommendations

Follow these recommendations to ensure reliable, high-perfor- mance operation[3].

■A four-layer impedance controlled board is required to maintain signal quality

■Specify impedance targets (ask your board vendor what they can achieve)

■To control impedance, maintain trace widths and trace spacing to within written specifications

■Minimize stubs to minimize reflected signals

Note

■Connections between the USB connector shell and signal ground must be done near the USB connector

■Bypass and flyback capacitors on VBus, near the connector, are recommended

■Keep DPLUS and DMINUS trace lengths within 2 mm of each other in length, with preferred length of 20 to 30 mm

■Maintain a solid ground plane under the DPLUS and DMINUS traces. Do not split the plane under these traces

■Do not place vias on the DPLUS or DMINUS trace routing

■Isolate the DPLUS and DMINUS traces from all other signal traces by no less than 10 mm

3.Source for recommendations: EZ-USB FX2™ PCB Design Recommendations, http:///www.cypress.com/cfuploads/support/app_notes/FX2_PCB.pdf High-Speed USB Platform Design Guidelines, http://www.usb.org/developers/docs/hs_usb_pdg_r1_0.pdf.

Document #: 38-08052 Rev. *G Page 13 of 15

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