CY62167EV18 MoBL®
16 Mbit (1M x 16) Static RAM
Features
■Very high speed: 55 ns
■Wide voltage range: 1.65V to 2.25V
■Ultra low standby power
❐Typical standby current: 1.5 μA
❐Maximum standby current: 12 μA
■Ultra low active power
❐Typical active current: 2.2 mA at f = 1 MHz
■Easy memory expansion with CE1, CE2, and OE features
■Automatic power down when deselected
■CMOS for optimum speed and power
■Offered in
Functional Description
The CY62167EV18 is a high performance CMOS static RAM organized as 1M words by 16 bits. This device features advanced circuit design to provide ultra low active current. This is ideal for providing More Battery Life™ (MoBL®) in portable applications such as cellular telephones. The device also has an automatic power down feature that reduces power consumption
by 99 percent when addresses are not toggling. Place the device into standby mode when deselected (CE1 HIGH or CE2 LOW or both BHE and BLE are HIGH). The input and output pins (I/O0 through I/O15) are placed in a high impedance state when: the device is deselected (CE1HIGH or CE2 LOW); outputs are disabled (OE HIGH); both Byte High Enable and Byte Low Enable are disabled (BHE, BLE HIGH); and a write operation is in progress (CE1 LOW, CE2 HIGH and WE LOW).
To write to the device, take Chip Enables (CE1 LOW and CE2 HIGH) and Write Enable (WE) input LOW. If Byte Low Enable (BLE) is LOW, then data from I/O pins (I/O0 through I/O7) is written into the location specified on the address pins (A0 through A19). If Byte High Enable (BHE) is LOW, then data from I/O pins (I/O8 through I/O15) is written into the location specified on the address pins (A0 through A19).
To read from the device, take Chip Enables (CE1 LOW and CE2 HIGH) and Output Enable (OE) LOW while forcing the Write Enable (WE) HIGH. If Byte Low Enable (BLE) is LOW, then data from the memory location specified by the address pins appears on I/O0 to I/O7. If Byte High Enable (BHE) is LOW, then data from memory appears on I/O8 to I/O15. See the Truth Table on page 9 for a complete description of read and write modes.
For best practice recommendations, refer to the Cypress application note AN1064, SRAM System Guidelines.
Logic Block Diagram |
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| DATA IN DRIVERS |
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A10 |
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A 9 | ROWDECODER |
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| SENSE AMPS |
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A 8 |
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A 7 |
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| 1M × 16 |
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A 6 |
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A 5 | RAM ARRAY | IO | 7 |
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A 4 |
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| 0 |
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A 3 |
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A 2 |
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A 1 |
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A 0 |
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| COLUMN DECODER |
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| CE2 |
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| BHE |
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| 11 | 12 | 13 | 14 | 15 16 17 18 | 19 |
| WE | CE2 | ||
Power Down | CE1 |
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| CE1 | ||||||||
| A A A A A A A A A |
| OE | ||||||||
Circuit | BHE |
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| BLE |
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| BLE |
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Cypress Semiconductor Corporation • 198 Champion Court | • | San Jose, CA | • | |
Document #: |
| Revised March 13, 2009 |
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