Cypress CY62167EV18 manual Features, Functional Description, Logic Block Diagram

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CY62167EV18 MoBL®

16 Mbit (1M x 16) Static RAM

Features

Very high speed: 55 ns

Wide voltage range: 1.65V to 2.25V

Ultra low standby power

Typical standby current: 1.5 μA

Maximum standby current: 12 μA

Ultra low active power

Typical active current: 2.2 mA at f = 1 MHz

Easy memory expansion with CE1, CE2, and OE features

Automatic power down when deselected

CMOS for optimum speed and power

Offered in Pb-free 48-ball VFBGA packages

Functional Description

The CY62167EV18 is a high performance CMOS static RAM organized as 1M words by 16 bits. This device features advanced circuit design to provide ultra low active current. This is ideal for providing More Battery Life(MoBL®) in portable applications such as cellular telephones. The device also has an automatic power down feature that reduces power consumption

by 99 percent when addresses are not toggling. Place the device into standby mode when deselected (CE1 HIGH or CE2 LOW or both BHE and BLE are HIGH). The input and output pins (I/O0 through I/O15) are placed in a high impedance state when: the device is deselected (CE1HIGH or CE2 LOW); outputs are disabled (OE HIGH); both Byte High Enable and Byte Low Enable are disabled (BHE, BLE HIGH); and a write operation is in progress (CE1 LOW, CE2 HIGH and WE LOW).

To write to the device, take Chip Enables (CE1 LOW and CE2 HIGH) and Write Enable (WE) input LOW. If Byte Low Enable (BLE) is LOW, then data from I/O pins (I/O0 through I/O7) is written into the location specified on the address pins (A0 through A19). If Byte High Enable (BHE) is LOW, then data from I/O pins (I/O8 through I/O15) is written into the location specified on the address pins (A0 through A19).

To read from the device, take Chip Enables (CE1 LOW and CE2 HIGH) and Output Enable (OE) LOW while forcing the Write Enable (WE) HIGH. If Byte Low Enable (BLE) is LOW, then data from the memory location specified by the address pins appears on I/O0 to I/O7. If Byte High Enable (BHE) is LOW, then data from memory appears on I/O8 to I/O15. See the Truth Table on page 9 for a complete description of read and write modes.

For best practice recommendations, refer to the Cypress application note AN1064, SRAM System Guidelines.

Logic Block Diagram

 

 

 

 

 

 

 

 

 

 

 

 

 

DATA IN DRIVERS

 

 

 

 

 

A10

 

 

 

 

 

 

 

 

 

 

 

A 9

ROWDECODER

 

 

 

 

 

SENSE AMPS

 

 

 

 

A 8

 

 

 

 

 

 

 

 

 

A 7

 

 

1M × 16

 

 

 

 

A 6

 

 

 

 

 

 

A 5

RAM ARRAY

IO

–IO

7

 

A 4

 

 

 

 

 

0

 

 

 

 

 

 

 

IO8–IO15

 

A 3

 

 

 

 

 

 

A 2

 

 

 

 

 

 

 

 

 

 

 

A 1

 

 

 

 

 

 

 

 

 

 

 

A 0

 

 

 

 

 

 

 

 

 

 

 

 

 

COLUMN DECODER

 

 

 

 

 

CE2

 

 

 

 

 

 

 

BHE

 

 

11

12

13

14

15 16 17 18

19

 

WE

CE2

Power Down

CE1

 

 

 

 

CE1

 

A A A A A A A A A

 

OE

Circuit

BHE

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

BLE

 

 

BLE

 

 

 

 

 

 

 

 

Cypress Semiconductor Corporation • 198 Champion Court

San Jose, CA 95134-1709

408-943-2600

Document #: 38-05447 Rev. *G

 

Revised March 13, 2009

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Contents Logic Block Diagram FeaturesFunctional Description Cypress Semiconductor Corporation 198 Champion CourtProduct Portfolio Pin ConfigurationMin Typ Max CY62167EV18LL CY62167EV30LL BLE BHEMaximum Ratings Electrical CharacteristicsOperating Range CapacitanceThermal Resistance Data Retention CharacteristicsVfbga Parameter Description 55 ns Unit Min Max Read Cycle Switching Waveforms Data I/O Valid Data Shows WE controlled write cycle waveforms.17, 21Shows CE1 or CE2 controlled write cycle waveforms.17, 21 Truth Table Inputs/Outputs Mode PowerCE1 CE2 BHE BLE Ordering Information Package DiagramBall Vfbga 6 x 8 x 1 mm REV ECN no Document HistoryOrig. Submission Change Date Description of Change USB Sales, Solutions, and Legal Information