Cypress CY62146EV30 Thermal Resistance, AC Test Loads and Waveforms, Data Retention Waveform

CY62146EV30 MoBL®

Capacitance (For All Packages) [9]

Parameter	Description	Test Conditions		Max	Unit
CIN	Input Capacitance	TA = 25°C, f = 1 MHz,		10	pF
		VCC = VCC(typ)
COUT	Output Capacitance			10	pF
Thermal Resistance [9]
Parameter	Description	Test Conditions	VFBGA	TSOP II	Unit
			Package	Package
ΘJA	Thermal Resistance	Still Air, soldered on a 3 × 4.5 inch,	75	77	°C/W
	(Junction to Ambient)	two-layer printed circuit board
ΘJC	Thermal Resistance		10	13	°C/W
	(Junction to Case)

AC Test Loads and Waveforms

VCC

R1

ALL INPUT PULSES

V

OUTPUT

30 pF

INCLUDING

JIG AND

SCOPE

	CC		90%
		90%
	10%			10%
R2	GND
	Rise Time = 1 V/ns			Fall Time = 1 V/ns

Equivalent to: THEVENIN EQUIVALENT

RTH

OUTPUT V

Parameters	2.50V	3.0V	Unit
R1	16667	1103	Ω
R2	15385	1554	Ω
RTH	8000	645	Ω
VTH	1.20	1.75	V

Data Retention Characteristics (Over the Operating Range)

Parameter	Description		Conditions		Min		Typ [2]	Max	Unit
VDR	VCC for Data Retention				1.5				V
ICCDR [8]	Data Retention Current	VCC = 1.5V,		> VCC – 0.2V,			0.8	7	∝A
			CE
		VIN > VCC – 0.2V or VIN < 0.2V
tCDR [9]	Chip Deselect to Data Retention Time					0			ns
t [10]	Operation Recovery Time				t	RC			ns
R

Data Retention Waveform

		VCC(min)	DATA RETENTION MODE		VCC(min)
V	CC		V	> 1.5V
		tCDR	DR		tR
CE
Notes:
9. Tested initially and after any design or process changes that may affect these parameters.
10. Full device operation requires linear VCC ramp from VDR to VCC(min) > 100 ∝s or stable at VCC(min) > 100 ∝s.

Document #: 38-05567 Rev. *C Page 4 of 12