Cypress CY14B101P manual Data Retention and Endurance, Capacitance, Thermal Resistance, Soic

Page 23

 

 

 

 

PRELIMINARY

CY14B101P

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Data Retention and Endurance

 

 

 

 

 

 

 

 

 

 

 

 

 

Parameter

 

 

 

Description

Min

Unit

DATAR

Data Retention

 

 

20

Years

NVC

Nonvolatile STORE Operations

200

K

Capacitance

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Parameter[6]

Description

 

Test Conditions

Max

Unit

CIN

Input Capacitance

 

TA = 25°C, f = 1MHz,

6

pF

 

 

 

VCC = 3.0V

 

 

COUT

Output Pin Capacitance

 

8

pF

Thermal Resistance

 

 

 

 

 

 

 

 

 

 

 

Parameter[6]

Description

 

Test Conditions

16-SOIC

Unit

ΘJA

Thermal Resistance

 

Test conditions follow standard test methods

TBD

°C/W

 

(Junction to Ambient)

 

and procedures for measuring thermal

 

 

 

 

 

 

impedance, per EIA / JESD51.

 

 

ΘJC

Thermal Resistance

 

TBD

°C/W

 

(Junction to Case)

 

 

 

 

 

 

Figure 24. AC Test Loads and Waveforms

3.0V

577Ω

3.0V

 

R1

OUTPUT

OUTPUT

30 pF

 

 

 

 

 

 

 

 

 

 

 

 

R2

5 pF

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

789Ω

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

577Ω

R1

R2 789Ω

AC Test Conditions

Input Pulse Levels

0V to 3V

Input Rise and Fall Times (10% - 90%)

<3 ns

Input and Output Timing Reference Levels

1.5V

Note

6. These parameters are guaranteed by design and are not tested.

Document #: 001-44109 Rev. *B

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Contents Sram Array FeaturesLogic Block Diagram OverviewHold PinoutsPin Definitions Pin Name Type Description Store Operation Device OperationSram Write Sram ReadSerial Peripheral Interface SPI Master Commonly used terms used in SPI protocol are given belowSPI Modes System Configuration Using SPI nvSRAMSPI Functional Description SPI Operating FeaturesWrite Status Register Wrsr Instruction Status RegisterRead Status Register Rdsr Instruction Block Protection Write Enable Wren InstructionWrite Disable Wrdi Instruction Write Protection and Block ProtectionWpen WEN Memory AccessRead Sequence Read Write Sequence WriteRead RTC Rdrtc Instruction Burst Mode Read Instruction TimingSoftware Store Store AutoStore DisableNvSRAM Special Instructions Write RTC Wrtc InstructionHold Pin Operation AutoStore Disable AsdisbAutoStore Enable Asenb Software Recall RecallReal Time Clock Operation Calibrating the Clock AlarmWatchdog Timer Flags Register Power MonitorInterrupt Register InterruptsRTC Recommended Component Configuration Accessing the Real Time Clock through SPIWDF Oscf RTC Register Map1 BCD Format Data Function/RangeOscen Register Map Detail Alarm DayAlarm Hours Alarm MinutesWDF Oscf CAL Register Map Detail Alarm SecondsTime Keeping Centuries Flags 0x00Parameter Description Test Conditions Min Max Unit DC Electrical CharacteristicsMaximum Ratings Operating RangeAC Test Conditions Data Retention and EnduranceCapacitance Thermal ResistanceAC Switching Characteristics ~ ~ ~ ~ Parameters Description CY14B101P Unit Min Max AutoStore or Power Up RecallSwitching Waveforms CY14B101P Hardware Store Pulse Width To Output Active Time when write latch not setHardware Store Cycle Parameter DescriptionCY 14 B 101 P SF X C T Ordering Code Package Diagram Package Type Operating RangeOrdering Information Part Numbering NomenclaturePin 300 mil Soic Package Package DiagramsSubmission Orig. Description of Change Date Document HistoryREV ECN no USB Sales, Solutions, and Legal InformationWorldwide Sales and Design Support Products PSoC Solutions