Transcend Information TS2G-8GCF266 manual TS2G~8GCF266

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TS2G~8GCF266

266X CompactFlash Card

 

 

 

Note: 1) The sender shall be tested while driving an 18 inch long, 80 conductor cable with PVC insulation material. The signal under test shall be cut at a test point so that it has not trace, cable or recipient loading after the test point. All other signals should remain connected through to the recipient. The test point may be located at any point between the sender’s series termination resistor and one half inch or less of conductor exiting the connector. If the test point is on a cable conductor rather than the PCB, an adjacent ground conductor shall also be cut within one half inch of the connector.

The test load and test points should then be soldered directly to the exposed source side connectors. The test loads consist of a 15 pF or a 40 pF, 5%, 0.08 inch by 0.05 inch surface mount or smaller size capacitor from the test point to ground. Slew rates shall be met for both capacitor values.

Measurements shall be taken at the test point using a <1 pF, >100 Kohm, 1 Ghz or faster probe and a 500 MHz or faster oscilloscope. The average rate shall be measured from 20% to 80% of the settled VOH level with data transitions at least 120 nsec apart. The settled VOH level shall be measured as the average output high level under the defined testing conditions from 100 nsec after 80% of a rising edge until 20% of the subsequent falling edge.

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Contents Dimensions Placement FeaturesDescription Transcend Block Diagram Pin Assignments and Pin Type TS2G~8GCF266 Signal Description TS2G~8GCF266 TS2G~8GCF266 TS2G~8GCF266 TS2G~8GCF266 Electrical Specification Output Drive Type Output Drive Characteristics Signal Interface Pull-up pin 45 BVD2 to avoid sensing their batteries as Low TS2G~8GCF266266X CompactFlash CardSeries termination required for Ultra DMA operation Ultra DMA Electrical RequirementsTable Typical Series Termination for Ultra DMA Ultra DMA Mode Cabling Requirement Attribute Memory Read Timing Specification TS2G~8GCF266 Common Memory Read Timing Specification Common Memory Write Timing Specification Input Read Timing Specification TS2G~8GCF266 Output Write Timing Specification TS2G~8GCF266 True IDE PIO Mode Read/Write Timing Specification TS2G~8GCF266 Table Ultra DMA Data Burst Timing True IDE Ultra DMA Mode Read/Write Timing SpecificationTS2G~8GCF266 TS2G~8GCF266 TS2G~8GCF266 TS2G~8GCF266 Single Function CF+ Cards Card ConfigurationMultiple Function CF+ Cards Table CF+ Card Register and Memory Space Decoding Table CF+ Card Configuration Registers DecodingAttribute Memory Function Attribute Memory FunctionConfiguration Option Register Base + 00h in Attribute Memory TS2G~8GCF266 Pin Replacement Register Base + 04h in Attribute Memory Socket and Copy Register Base + 06h in Attribute Memory Transfer Function Table Pcmcia Mode I/O FunctionTable Common Memory Function Common Memory Transfer FunctionTrue IDE Mode I/O Transfer Function Metaformat Overview CF-ATA Drive Register Set Definition and Protocol Table Primary and Secondary I/O Decoding Primary and Secondary Address ConfigurationsTable Contiguous I/O Decoding Contiguous I/O Mapped AddressingMemory Mapped Addressing True IDE Mode AddressingData Register Address 1F0h170hOffset 0,8,9 CF-ATA RegistersCylinder Low LBA 15-8 Register Address 1F4h174h Offset Feature Register Address 1F1h171h Offset 1, 0Dh Write OnlySector Count Register Address 1F2h172h Offset Sector Number LBA 7-0 Register Address 1F3h173h OffsetTS2G~8GCF266 Device Control Register Address 3F6h376h Offset Eh Card Drive Address Register Address 3F7h377h Offset Fh CF-ATA Command Set Check Power Mode 98h or E5h Erase Sectors C0h Execute Drive Diagnostic 90hFormat Track 50h Flush Cache E7hIdentify Device Ech TS2G~8GCF266 Word 0 General Configuration Word 49 Capabilities Bit 13 Standby Timer Word 1 Default Number of CylindersWord 3 Default Number of Heads Word 6 Default Number of Sectors per TrackCurrent Number of Cylinders, Heads, Sectors/Track Multiple Sector SettingTotal Sectors Addressable in LBA Mode Translation Parameters ValidWord 68 Minimum PIO transfer cycle time with Iordy Words 82-84 Features/command sets supportedWord 65 Minimum Multiword DMA transfer cycle time Recommended Multiword DMA transfer cycle timeWords 85-87 Features/command sets enabled Word 89 Time required for Security erase unit completion Word 88 Ultra DMA Modes Supported and SelectedAdditional Requirements for CF Advanced Timing Modes Word 91 Advanced power management level valueWord 160 Power Requirement Description Word 128 Security Status Bit 8 Security LevelTS2G~8GCF266 Idle 97h or E3h Initialize Drive Parameters 91h Idle Immediate 95h or E1hNOP 00h Read DMA C8h Read Long Sector 22h or 23h Read Buffer E4hTS2G~8GCF266 Recalibrate 1Xh Request Sense 03h Seek 7Xh Set Features EFh Feature Supported TS2G~8GCF266 Translate Sector Information Standby Immediate 94h or E0h Translate Sector 87hWear Level F5h Write Buffer E8h Write DMA CAh TS2G~8GCF266 TS2G~8GCF266 Error Posting Smart Command Set Smart Feature Register Values Smart Command SetS. Table Capacity Decription Smart Data Structure