Honeywell Mark III manual Mechanical Design, Interconnect CCA

5 HARDWARE DESCRIPTION

5.1 Mechanical Design

The MARK III is a modular design that consists of a number of circuit card assemblies (CCAs) which are enclosed in a lightweight aluminum chassis. The internal interconnect between circuit card assemblies consists of a combination of highly reliable card-to-card connections and aerospace quality ribbon cables. The rear interconnect circuit card assembly provides most of the connections between CCAs.

The MARK III is designed so that it may be repaired and trouble-shot at the end-item level without expensive CCA level test equipment. The design is modular so that any CCA may be replaced with minimal effort. The MARK III consists of four CCAs with growth for two additional CCAs. These CCAs are described in the following sections. Figure 31 illustrates the top view of the Mark III CMU.

PROCESSOR CCA

INPUT/OUTPUT CCA

POWER SUPPLY

GROWTH CCA #1

GROWTH CCA #2

ARINC 600

INTERCONNECT CCA

Figure 31 MARK III Top View

5.1.1 Interconnect CCA

The A1 Interconnect circuit card assembly provides interconnect between connector, the Processor CCA, Power Supply CCA and Input/Output CCA. features:

the unit's rear ARINC 600 The CCA has the following

Signals are routed in a multi-layer PWB that is designed to reduce emissions and RF Susceptibility.

The circuit card assembly contains lightning suppression circuitry that meets the latest requirements of DO- 160D. ARINC 600 connector pins are replaceable on an individual pin basis (front removable).

The interconnection of plug-in CCAs is done by PCI Bus-Based connectors.

HONEYWELL Aerospace Electronic Systems Page 47

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