Honeywell Mark III manual Mechanical Packaging Unit Weight, Unit Size, Unit Connectors and Mounts

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5.3 Mechanical Packaging

5.3.1 Unit Weight

The MARK III LRU maximum weight is twelve pounds.

5.3.2 Unit Size

The MARK III LRU is a 4-MCU box that meets the dimensional specifications in ARINC 600. The unit has the following dimensions in inches:

 

 

 

 

Length+Front Face

 

 

 

 

Projections

 

Width*

Height*

Length (Maximum)

(Maximum)

MARK III

4.88 + .020

7.62 + .020

12.76

15.26

 

 

 

 

 

* Height and Width are for Unit Cover, the Front plate shall slightly exceed these dimensions.

5.3.3 Unit Connectors and Mounts

The MARK III provides a low insertion force, size 2, ARINC 600 rear connector shell assembly as defined in ARINC 758 for standard interconnect. The connector is located on the center grid of the MARK III rear panel.

The portable data loader connector that is contained on the unit’s front panel is a 53-pin circular connector that as specified in ARINC 615 for standard interconnect. The PDL front panel connector that mates with the LRU is connector type MS27473T-18A-53P.

The mounting tray which is used for installing the unit in an aircraft may be any commercially available mount which is designed for the dimensional requirements in ARINC 600 for a 4-MCU unit. No special requirements exist for this mount.

5.3.4 Cooling Requirements

The MARK III is designed to accept cooling air using the method described in ARINC 600 or ARINC 404A. The nominal cooling airflow requirement for the MARK III per ARINC 758 is 22.0 kilograms/hour of 40 degrees centigrade (maximum) air. The coolant air pressure drop through the MARK III should be 25 +2.5 millimeters of water.

If aircraft conditioned air is not available, the MARK III may be installed using an ARINC 600 equipment tray that has an integral cooling an installed in the plenum.

HONEYWELL Aerospace Electronic Systems

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Contents Honeywell Aerospace Electronic Systems Honeywell Aerospace Electronic Systems Introduction Mark III CMU OverviewDatalink Capability for Today and Tomorrow Honeywell Datalink Experience, Products, and Services Page Hardware Overview ArincSystem Interfaces Mark III CMU Interfaces DeviceArinc Interface Baseline Specificati GrowthSubnetwork Interfaces Arinc VDR SDU HfdrCMU Arinc 750 VHF Data Radio VDRFlight Deck Devices Interfaces UHFControl and Display Unit CDU Mcdu Midu CDULRU Interfaces Flight Management Computer FMCPerformance Computer PZ Aircraft Condition Monitoring System AcmsOther Interfaces Software Overview MIL-STD-1553BPcmcia OooiCMF VIACMU AOC HGI AMI Fidb Gbst Database DesignCertification Baseline Functionality AOA VDLM2Operations Uplink ProcessingDownlink Processing World RegionsDMT and DLT System PagesBite VDL Mode Growth FunctionalityAPM Data LoadingPcmcia Data Loading Arinc 761 SatcomMil-STD Weather GraphicsATN Encryption/AuthenticationRRI Page Databases FidbGbst Fidb ArchitectureFidb HGI AMI Menus Main MenuMain Menu CDU Main Menu Supporting Regional / Business Jet CDUs ATS Menu System Menu Uplinks Clearance UplinkClearance Message Elements Clearance Message References Reject Reasons Reject Reasons Values Downlinks Diversion Report DownlinkDiversion Reasons Divert Message Elements Print Definition Logic UnitsPreferred Channel Management Oooi Logic UnitRegions US Map Areas Mechanical Design Interconnect CCAProcessor CCA Power Supply CCAInput/Output CCA Spare CCAs Growth Detailed Interface DefinitionMcdu PrntrCMC ADLSDI PGM VHF PGM OooiVOICE/DATA MON SEL CMUMechanical Packaging Unit Weight Unit Connectors and MountsUnit Size Cooling RequirementsEnvironmental Specifications Power Input DO-160D Section Induced Signal Susceptibility DO-160D SectionWaterproofness DO-160D Section Fluids Susceptibility DO-160D Section1 115 Vac Input Power Requirements Power Requirements2 28 Vdc Input Power Requirements 3 28 Vdc Backup Input Power Requirements Power Interrupt RequirementsTechnical Summary