Sony Hong Kong model Waveforms, Display Section, For schematic diagrams, Indication of transistor

Page 31

THIS NOTE IS COMMON FOR PRINTED WIRING BOARDS AND SCHEMATIC DIAGRAMS.

(In addition to this, the necessary note is printed in each block.)

For schematic diagrams.

Note:

All capacitors are in µF unless otherwise noted. pF: µµF 50 WV or less are not indicated except for electrolytics and tantalums.

All resistors are in Ω and 1/4 W or less unless otherwise specified.

¢ : internal component.

C : panel designation.

Note:

Note:

The components identi-

Les composants identifiés par

fied by mark !or dotted

une marque !sont critiques

line with mark !are criti-

pour la sécurité.

cal for safety.

Ne les remplacer que par une

Replace only with part

piéce portant le numéro

number specified.

spécifié.

 

 

U : B+ Line.

V : B– Line.

H : adjustment for repair.

no mark : STOP

(

) : Play the test disc (TDYS-1)

<> : REC

: Can not be measured.

Voltages are taken with a VOM (Input impedance 10 MΩ). Voltage variations may be noted due to normal produc- tion tolerances.

Waveforms are taken with a oscilloscope.

Voltage variations may be noted due to normal produc- tion tolerances.

Circled numbers refer to waveforms.

Signal path.

E : PB

j : REC

a : PB (DIGITAL OUT)

l : REC (DIGITAL IN)

Abbreviation

CND : Canadian model.

SP : Singapore model.

For printed wiring boards.

Note:

X : parts extracted from the component side.

Y : parts extracted from the conductor side.

® : Through hole.

b: Pattern from the side which enables seeing. (The other layers' patterns are not indicated.)

Caution:

Pattern face side: Parts on the pattern face side seen from the

(Side B) pattern face are indicated.

Parts face side: Parts on the parts face side seen from the

(Side A)

parts face are indicated.

Indication of transistor

C

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Q

 

 

These are omitted

 

 

 

 

 

 

 

 

 

 

 

B E

 

 

 

BC E

These are omitted

WAVEFORMS

– BD (1/2) SECTION –

1

0.46Vp-p

IC101 1, 2 (I, J) (PLAY mode)

2

0.1Vp-p

IC101 4 (A) (PLAY mode)

3

0.06Vp-p

IC101 8, 9 (E, F) (PLAY mode)

– BD (2/2) SECTION –

4

3.1Vp-p

22.581MHz

IC121 (OSCI)

5

3.2Vp-p

44.1kHz

IC121 (LRCK)

6

3.8Vp-p

2.822MHz

IC121 @• (XBCK)

7

3.8Vp-p

11.29MHz

IC121 (FS256)

8

3.2Vp-p

176.4kHz

IC121 (FS4)

MDS-JE330

– MAIN SECTION –

1

3.2Vp-p

10MHz

IC501 (XOUT)

2

3.8Vp-p

44.1kHz

IC301 (L3CLK)

3

3.4Vp-p

2.822MHz

IC301 (BCK)

4

3.0Vp-p

22.581MHz

IC301 !™ (SYSCLK)

– DISPLAY SECTION –

1

3.9Vp-p

2.4MHz

IC761 %• (OSCO)

– 33 –

– 34 –

Image 31
Contents MDS-JE330 SpecificationsSELF-DIAGNOSIS Function Items of Error History Mode Items and Contents Varnig Flexible Circuit Board RepairingExploded Views Table of ContentsDisassembly DiagramsTEO Section Servicing NoteJIG for Checking BD Board Waveform IOPRecord Precedure REC/PLAY Checks Prior to Parts Replacement and AdjustmentsForced Reset Criteria for Determination Measure if unsatisfactoryBit Binary Retry Cause Display ModeHigher Bits Lower Bits Hexa Details Bit When BinaryHexadecimal Binary Location of Parts and Controls Section GeneralFront Panel Case and Front Panel Section DisassemblySlider CAM SW Board and Loading Motor M103 Base Unit MBU-5A and BD BoardExiting the Test Mode Section Test ModePrecautions for USE of Test Mode Setting the Test ModeGroup Selecting the Test ModeOUT Operating the Continuous Playback ModeNon-Volatile Memory Mode EEP Mode MIDFunctions of Other Buttons Test Mode DisplaysMeanings of Other Displays Parts Replacement and Adjustment Section Electrical AdjustmentsCreating Continuously Recorded Disc Precautions for Checking Laser Diode EmissinonPrecautions for USE of Optical PICK- UP KMS-260A Precautions for AdjustmentsSpecified Value Temperature Compensation Offset CheckLaser Power Check Checks Prior to RepairsSelf-Recording/playback Check Play Checking MO Error Rate CheckCD Error Rate Check Focus Bias CheckRecording and Displaying the IOP Information Initial Setting of Adjustment ValueTemperature Compensation Offset Adjutment Laser Power AdjustmentTraverse Adjustment Focus Bias Adjustment MO Auto Gain Control Output Level Adjustment Error Rate CheckAuto Gain Control Output Level Adjustment CD Auto Gain Control Output Level AdjustmentAdjusting Points and Connecting Points Circuit Boards Location Section DiagramsMDS-JE330 Block Diagrams BD SectionLD-LOVO Main SectionDisplay Section For schematic diagramsFor printed wiring boards WaveformsSemiconductor Location Printed Wiring Board BD SectionSchematic Diagram BD 1/2 Section Schematic Diagram BD 2/2 Section Schematic Diagram Main 1/2 Section Schematic Diagram Main 2/2 Section Printed Wiring Board Main Section Printed Wiring Board Panel Section Schematic Diagram Panel Section Printed Wiring Board BD Switch Section Schematic Diagram BD Switch Section IC Block DiagramsBD Section IC101 IC152 BH6511FS-E2 IC121 CXD2654RIC381 M5218AL IC441 LB1641 Main section IC301 UDA1341TS/N2IC406 M62016L IC101 RF Amplifier CXA2523AR BD board IC PIN FunctionsPin No Pin Name Function MNT3 Sloc MNT0 FOKMNT1 Shck MNT2 XbusyAvdd MvciAsyo AsyiFS4 TfdrFfdr FrdrIC501 System Control M30620MC-400FP Main board SDA OPT DEL OPT SEL Mode SELPB-P REC/PBCase and Back Panel Section Section Exploded Views6162 Front Panel Section225 226 206 205 Mechanism Section MDM-5A251 252 Base Unit Section MBU-5AResistors Section Electrical Parts ListDisplay Display KEY SW Main PIN, Connector 7P Inductor Vibrator MDS-JE330 Main SW VOL SEL