Sony Hong Kong model Section Servicing Note, JIG for Checking BD Board Waveform, Iop, Teo

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SECTION 1

SERVICING NOTE

JIG FOR CHECKING BD BOARD WAVEFORM

The special jig (J-2501-149-A) is useful for checking the waveform of the BD board. The names of terminals and the checking items to be performed are shown as follows.

GND : Ground

I+3V : For measuring IOP (Check the deterioration of the optical pick-up laser)

IOP	: For measuring IOP (Check the deterioration of the optical pick-up laser)
TEO	: TRK error signal (Traverse adjustment)
VC	: Reference level for checking the signal
RF	: RF signal (Check jitter)

Mechanism deck

CN110

6P connector

5P Connector

VC

RF

TEO

IOP

I+3V

GND

	1	RF
RF		VC	For
		TEO	For
		TEO	MDM-3
VC		IOP	MDM-3
VC		IOP
TEO	5	I-3V
TEO
IOP	1	VC
I+3V		RF	For
I+3V		TEO	For
		IOP	MDM-5
GND	6	I+3V
	6	GND

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Image 6

Contents Specifications MDS-JE330SELF-DIAGNOSIS Function Items of Error History Mode Items and Contents Flexible Circuit Board Repairing VarnigDiagrams Table of ContentsDisassembly Exploded ViewsIOP Section Servicing NoteJIG for Checking BD Board Waveform TEORecord Precedure Criteria for Determination Measure if unsatisfactory Checks Prior to Parts Replacement and AdjustmentsForced Reset REC/PLAYRetry Cause Display Mode Bit BinaryBit When Binary Higher Bits Lower Bits Hexa DetailsHexadecimal Binary Section General Location of Parts and ControlsFront Panel Section Disassembly Case and Front PanelSlider CAM Base Unit MBU-5A and BD Board SW Board and Loading Motor M103Setting the Test Mode Section Test ModePrecautions for USE of Test Mode Exiting the Test ModeSelecting the Test Mode GroupMID Operating the Continuous Playback ModeNon-Volatile Memory Mode EEP Mode OUTTest Mode Displays Functions of Other ButtonsMeanings of Other Displays Section Electrical Adjustments Parts Replacement and AdjustmentPrecautions for Adjustments Precautions for Checking Laser Diode EmissinonPrecautions for USE of Optical PICK- UP KMS-260A Creating Continuously Recorded DiscChecks Prior to Repairs Temperature Compensation Offset CheckLaser Power Check Specified ValueFocus Bias Check Play Checking MO Error Rate CheckCD Error Rate Check Self-Recording/playback CheckLaser Power Adjustment Initial Setting of Adjustment ValueTemperature Compensation Offset Adjutment Recording and Displaying the IOP InformationTraverse Adjustment Focus Bias Adjustment CD Auto Gain Control Output Level Adjustment Error Rate CheckAuto Gain Control Output Level Adjustment MO Auto Gain Control Output Level AdjustmentAdjusting Points and Connecting Points Section Diagrams Circuit Boards LocationBlock Diagrams BD Section MDS-JE330Main Section LD-LOVOWaveforms For schematic diagramsFor printed wiring boards Display SectionPrinted Wiring Board BD Section Semiconductor LocationSchematic Diagram BD 1/2 Section Schematic Diagram BD 2/2 Section Schematic Diagram Main 1/2 Section Schematic Diagram Main 2/2 Section Printed Wiring Board Main Section Printed Wiring Board Panel Section Schematic Diagram Panel Section Schematic Diagram BD Switch Section IC Block Diagrams Printed Wiring Board BD Switch SectionBD Section IC101 IC121 CXD2654R IC152 BH6511FS-E2Main section IC301 UDA1341TS/N2 IC381 M5218AL IC441 LB1641IC406 M62016L IC PIN Functions IC101 RF Amplifier CXA2523AR BD boardPin No Pin Name Function MNT2 Xbusy MNT0 FOKMNT1 Shck MNT3 SlocAsyi MvciAsyo AvddFrdr TfdrFfdr FS4IC501 System Control M30620MC-400FP Main board REC/PB OPT DEL OPT SEL Mode SELPB-P SDASection Exploded Views Case and Back Panel SectionFront Panel Section 6162Mechanism Section MDM-5A 225 226 206 205Base Unit Section MBU-5A 251 252Section Electrical Parts List ResistorsDisplay Display KEY SW Main PIN, Connector 7P Inductor MDS-JE330 Main SW VOL SEL Vibrator