Sony MDS-PC3 Section Service Notes, Flexible Circuit Board Repairing, Lead free soldering

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SECTION 1

SERVICE NOTES

NOTES ON HANDLING THE OPTICAL PICK-UP BLOCK OR BASE UNIT

The laser diode in the optical pick-up block may suffer electrostatic break-down because of the potential difference generated by the charged electrostatic load, etc. on clothing and the human body.

During repair, pay attention to electrostatic break-down and also use the procedure in the printed matter which is included in the repair parts.

The flexible board is easily damaged and should be handled with care.

NOTES ON LASER DIODE EMISSION CHECK

Never look into the laser diode emission from right above when checking it for adjustment. It is feared that you will lose your sight.

Laser component in this product is capable of emitting radiation exceeding the limit for Class 1.

This appliance is classified as a CLASS 1 LASER product. The

CLASS 1 LASER PRODUCT MARKING is located on the rear exterior.

This caution label is located inside the unit.

CAUTION

Use of controls or adjustments or performance of procedures other than those specified herein may result in hazardous radia- tion exposure.

Notes on chip component replacement

Never reuse a disconnected chip component.

Notice that the minus side of a tantalum capacitor may be damaged by heat.

Flexible Circuit Board Repairing

Keep the temperature of soldering iron around 270˚C during repairing.

Do not touch the soldering iron on the same conductor of the circuit board (within 3 times).

Be careful not to apply force on the conductor when soldering or unsoldering.

SAFETY-RELATED COMPONENT WARNING!!

COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS

LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.

Lead free soldering

MAIN and PANEL boards of this product are lead free soldered (contains no lead).

Lead-free solder have the following characteristics.

• The melting point is about 40 ºC higher than conventional solder. Conventional soldering iron can be used, but must be pressed for a longer time.

When using the soldering iron with a temperature adjustment func- tion, set to about 350 ºC.

Note: Pressing the soldering iron too long may cause the board pat- tern (copper coating) to peel off.

Strong viscosity

As it has stronger viscosity than conventional solder, make sure the IC terminal does not solder bridge.

Can be used with conventional solder

Though it is best to add lead-free solder only, conventional solder can also be added.

Boards using lead-free solder are printed with the LF mark mean- ing “Lead Free”.

SAFETY CHECK-OUT

After correcting the original service problem, perform the follow- ing safety check before releasing the set to the customer:

Check the antenna terminals, metal trim, “metallized” knobs, screws, and all other exposed metal parts for AC leakage.

Check leakage as described below.

LEAKAGE TEST

The AC leakage from any exposed metal part to earth ground and from all exposed metal parts to any exposed metal part having a return to chassis, must not exceed 0.5 mA (500 microamperes). Leak- age current can be measured by any one of three methods.

1.A commercial leakage tester, such as the Simpson 229 or RCA WT-540A. Follow the manufacturers’ instructions to use these instruments.

2.A battery-operated AC milliammeter. The Data Precision 245 digital multimeter is suitable for this job.

3.Measuring the voltage drop across a resistor by means of a VOM or battery-operated AC voltmeter. The “limit” indication is 0.75 V, so analog meters must have an accurate low-voltage scale. The Simpson 250 and Sanwa SH-63Trd are examples of a pas- sive VOM that is suitable. Nearly all battery operated digital multimeters that have a 2 V AC range are suitable. (See Fig. A)

To Exposed Metal

Parts on Set

0.15 F

 

 

 

1.5 k

AC

 

 

 

voltmeter

 

 

 

 

 

(0.75 V)

 

 

 

 

 

 

Earth Ground

Fig. A. Using an AC voltmeter to check AC leakage.

ATTENTION AU COMPOSANT AYANT RAPPORT

À LA SÉCURITÉ!

LES COMPOSANTS IDENTIFÉS PAR UNE MARQUE 0 SUR LES

DIAGRAMMES SCHÉMATIQUES ET LA LISTE DES PIÈCES SONT CRITIQUES POUR LA SÉCURITÉ DE FONCTIONNEMENT. NE REMPLACER CES COMPOSANTS QUE PAR DES PIÈSES SONY DONT LES NUMÉROS SONT DONNÉS DANS CE MANUEL OU

DANS LES SUPPÉMENTS PUBLIÉS PAR SONY.

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Contents MDS-PC3 SpecificationsTOC t Edit t TOC Edit t blank t SELF-DIAGNOSIS FunctionItems of Error History Mode Items and Contents Disassembly Table of ContentsDiagrams Table of Error CodesLead free soldering Section Service NotesFlexible Circuit Board Repairing JIG for Checking BD Board Waveform Record Precedure Main Board Component Side Checks Prior to Parts Replacement and AdjustmentsForced Reset Bit Binary Retry Cause Display ModeHexadecimal t Binary Conversion Table General Section Remote Parts DescriptionUsing the Display Hooking Up MD Mechanism Deck MDM-7A Section DisassemblyOver Light Head HR901, BD MD Board Main BoardLoading Motor Assy M103 Holder AssyOptical PICK-UP MD KMS-260B/JIN Sled Motor Assy M102, SliderSpindle Motor Assy M101 Precautions for USE of Test Mode Section Test ModeSetting the Test Mode Exiting the Test ModeDisplay Details Mark Group Selecting the Test ModeOperating the Continuous Playback Mode Mode display Test Mode DisplaysError rate display Functions of Other ButtonsInformation Meanings of Other DisplaysAutomatic SELF-DIAGNOSIS Function Check before replacement Section Electrical AdjustmentsParts Replacement and Adjustment Adjustment flow Precautions for Adjustments Precautions for Checking Laser Diode EmissionPrecautions for USE of Optical PICK- UP KMS-260B Checks Prior to Repairs Using the Continuously Recorded DiscOther Checks Auto CheckCD Error Rate Check Play Check MO Error Rate CheckLaser Power Adjustment Initial Setting of Adjustment ValueTemperature Compensation Offset Adjutment Iop NV Save Traverse AdjustmentFocus Bias Adjustment Auto Gain Control Output Level Adjustment Error Rate CheckCD Auto Gain Control Output Level Adjustment MO Auto Gain Control Output Level AdjustmentAdjusting Points and Connecting Points Diagrams MDS-PC3 Block Diagrams BD SectionSclk Cclk Main SectionSemiconductor Printed Wiring Board BD SectionPIN Function MDS-PC3 Printed Wiring Board Main Section PIN Functon MDS-PC3 Printed Wiring Board Panel Section Schematic Diagram Panel Section See page 35 for Waveforms IC101 CXA2523AR BD Board IC Block DiagramsLB1830M-S-TE-L Main Board BH3541F-E2 Main Board IC101 CXA2523AR RF Amplifier BD Board IC PIN FunctionsMNT0 FOK Mvci IC300 M30805SGP Main Board Shck MNT1 Chassis Section Section Exploded Views319 302 320 317 304 308 303 305 306 301 318 307 Mechanism MDM-7A351 MechanismRemarks Ref. No Description Section Electrical Parts ListMetal Chip Main PIN, Connector 2P Diode Main Panel KEY REFLECT/PROTECT SW MDS-PC3 Panel