Renesas M65881AFP manual

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M65881AFP

Sales Strategic Planning Div. Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan

Keep safety first in your circuit designs!

1.Renesas Technology Corporation puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble may occur with them. Trouble with semiconductors may lead to personal injury, fire or property damage.

Remember to give due consideration to safety when making your circuit designs, with appropriate measures such as (i) placement of substitutive, auxiliary circuits, (ii) use of nonflammable material or (iii) prevention against any malfunction or mishap.

Notes regarding these materials

1.These materials are intended as a reference to assist our customers in the selection of the Renesas Technology Corporation product best suited to the customer’s application; they do not convey any license under any intellectual property rights, or any other rights, belonging to Renesas Technology Corporation or a third party.

2.Renesas Technology Corporation assumes no responsibility for any damage, or infringement of any third-party’s rights, originating in the use of any product data, diagrams, charts, programs, algorithms, or circuit application examples contained in these materials.

3.All information contained in these materials, including product data, diagrams, charts, programs and algorithms represents information on products at the time of publication of these materials, and are subject to change by Renesas Technology Corporation without notice due to product improvements or other reasons. It is therefore recommended that customers contact Renesas Technology Corporation or an authorized Renesas Technology Corporation product distributor for the latest product information before purchasing a product listed herein.

The information described here may contain technical inaccuracies or typographical errors.

Renesas Technology Corporation assumes no responsibility for any damage, liability, or other loss rising from these inaccuracies or errors.

Please also pay attention to information published by Renesas Technology Corporation by various means, including the Renesas Technology Corporation Semiconductor home page (http://www.renesas.com).

4.When using any or all of the information contained in these materials, including product data, diagrams, charts, programs, and algorithms, please be sure to evaluate all information as a total system before making a final decision on the applicability of the information and products. Renesas Technology Corporation assumes no responsibility for any damage, liability or other loss resulting from the information contained herein.

5.Renesas Technology Corporation semiconductors are not designed or manufactured for use in a device or system that is used under circumstances in which human life is potentially at stake. Please contact Renesas Technology Corporation or an authorized Renesas Technology Corporation product distributor when considering the use of a product contained herein for any specific purposes, such as apparatus or systems for transportation, vehicular, medical, aerospace, nuclear, or undersea repeater use.

6.The prior written approval of Renesas Technology Corporation is necessary to reprint or reproduce in whole or in part these materials.

7.If these products or technologies are subject to the Japanese export control restrictions, they must be exported under a license from the Japanese government and cannot be imported into a country other than the approved destination.

Any diversion or reexport contrary to the export control laws and regulations of Japan and/or the country of destination is prohibited.

8.Please contact Renesas Technology Corporation for further details on these materials or the products contained therein.

http://www.renesas.com

Copyright © 2003. Renesas Technology Corporation, All rights reserved. Printed in Japan.

Rev.1.00 2003.05.08

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Contents Description FeaturesMain Specification System Block DiagramPIN Configuration HPOUTR2 OUTL1 Data OUTL2Lrck OUTR2 HPOUTL1 HPOUTL2 Parameter Level Input Voltage Input Leek Current Absolute Maximum RatingsGND Characteristics Evaluation CircuitPIN Description DATA,BCK,LRCK Explanation of OperationScdt Scshift Sclatch SCDT, SCSHIFT, SclatchMCKSEL, XfsoIN, XfsoOUT FsoI, Sflag ASYNCEN2=enableChsel OUTL1, OUTL2, OUTR1, OUTR2PWM output control NSPMUTEL,NSPMUTER HTEST1, TEST2 Power supply and GNDHPOUTL1, HPOUTL2, HPOUTR1, HPOUTR2 InitInit Scdt Scshift Sclatch Power sequences System power-on sequencingNSLMT1,2 Serial ControlMantissa Data decimal value 128 Characteristics of Soft Mute function IFMT1 IBIT0 MODE1MODE2 IFMT0Rev.1.00 System2 Mode Rev.1.00 AC Characteristics Timing Chart AC CharacteristicsApplication Example DSP MCUPackage DiagramM65881AFP