Agilent Technologies 5203 manual Electromagnetic Interference EMI, Immunity

12.0

0.51

11.1 0.75

9.53 (NOTE 1)

12.09

6.79

42.0

24.8

39.12

9

Electromagnetic Interference (EMI)

Most equipment designs utilizing these high speed transceivers from Agilent will be required to meet the requirements of FCC in the United States, CENELEC EN55022 (CISPR 22) in Europe and VCCI in Japan.

25.4These products are suitable for use in designs ranging from a desktop computer with a single transceiver to a concentrator or

switch product with large number of transceivers.

In all well-designed chassis, the two 0.5" holes required for ST connectors to protrude through, will provide 4.6 dB more shielding than one 1.2" duplex SC rectangular cutout. Thus, in a

25.4 well-designed chassis, the duplex

ST 1x9 transceiver emissions will

be identical to the duplex SC 1x9

transceiver emissions.

Immunity

Equipment utilizing these trans-

ceivers will be subject to radio-

NOTE 1: MINIMUM DISTANCE FROM FRONT

OF CONNECTOR TO THE PANEL FACE.

Figure 8a. Recommended Common Mechanical Layout for ST and ST 1x9 Connectored Transceivers.

frequency electromagnetic fields

in some environments. These

transceivers have a high immunity

to such fields.

For additional information regard-

ing EMI, susceptibility, ESD and

conducted noise testing proce-

dures and results on the 1x9

transceiver family, please refer to

Applications Note 1075, Testing

and Measuring Electro-

magnetic Compatibility

Performance of the HFBR-

510X/-520X Fiber Optic

Transceivers.