8
Board Layout - Art Work
The Applications Engineering
group is developing Gerber file
art work for a multilayer printed
circuit board layout incorporating
the recommendations above.
Contact your local Agilent sales
representative for details.
Board Layout - Mechanical
For applications interested in
providing a choice of either a
duplex SC or a duplex ST con-
nector interface, while utilizing
the same pinout on the printed
circuit board, the ST port needs
to protrude from the chassis
panel a minimum of 9.53 nm for
sufficient clearance to install the
ST connector.
Please refer to Figure 8a for a
mechanical layout detailing the
recommended location of the
duplex SC and duplex ST
transceiver packages in relation
to the chassis panel.
Regulatory Compliance
These transceiver products are
intended to enable commercial
system designers to develop
equipment that complies with the
various international regulations
governing certification of Infor-
mation Technology Equipment.
See the Regulatory Compliance
Table for details. Additional
information is available from your
Agilent sales representative.
Electrostatic Discharge (ESD)
There are two design cases in
which immunity to ESD damage
is important.
The first case is during handling
of the transceiver prior to
mounting it on the circuit board.
It is important to use normal ESD
handling precautions for ESD
sensitive devices. These precau-
tions include using grounded
wrist straps, work benches, and
floor mats in ESD controlled
areas.
The second case to consider is
static discharges to the exterior of
the equipment chassis containing
the transceiver parts. To the
extent that the duplex SC
connector is exposed to the
outside of the equipment chassis
it may be subject to whatever ESD
system level test criteria that the
equipment is intended to meet.
Figure 8. Recommended Board Layout Hole Pattern.
(8X) 2.54
.100
20.32
.800
20.32
.800
1.9 ± 0.1
.075 ± .004
(2X) ø
Ø0.000 MA
0.8 ± 0.1
.032 ± .004
(9X) ø
Ø0.000 MA
–A–
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