S62F Hardware Technical Specification Rev. 1.0 06/03/28
ASUSTeK Confidential Page 52
7 MODULE SPECIFICATION
7.1 Overall System
The notebook system consists of the following PCB assembly and modules.
7.1.1 Board assembly
Processor Upgradeable CPU (u-PGA 479)
Main Board Main System board
Inverter Board LCD Module Back-light
TOUCH PAD 5 LED Indicators, 2 Touch Pad Button
SO-DIMM Module Memory Expansion
Modem Board MDC
7.2 Processor
Feature: Intel Yonah processor with on-die L2 cache.
u-PGA 479
[CPU Cooling System]
Function:
For cooling the CPU
Cooling of CPU by heat sink and FAN. FAN is
controlled by a thermal senso r and BIOS/ACPI OS.