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Asus
S62F
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Upgrade & Replacement
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Removing ODD Module
1.
Remove 1 screw (M2.5*4L (K)).
ODD
REMOVAL
M2.5*4L
2.
Push the ODD Module out
by a pair of tweezers.
Installing new ODD module
3.
Insert the ODD module.
ODD MODULE
INSTALLATION
Contents
Main
Service Overview
T
S62F Series Overview and Components
S62F Ov erview
Page
Components
Page
Page
Page
Page
Page
Service Overview
Precautions
Appropriate Tools
Disassembly Procedure
A
Ba ttery Module
HDD Module
Wireless LAN Module
Memory Module
CPU Module
Unlock
ODD Module
Keyboard
Top Case Module
Page
Page
Inverter & camera cable Antenna
Page
Page
Motherboard
Bluetooth cable S
p
eaker cable
Page
Bottom Case Module
L CD Module
Page
Page
Page
Page
Page
Assembly Procedure
A
L CD Module
Page
Page
Page
Page
Bottom Case Module
Motherboard
Page
Bluetooth cable S
p
eaker cable
Top Case Module
Page
Page
Inverter & camera cable Antenna
Page
Page
Assembling K eyboard
ODD Module
CPU Module Assembly
Loc
k
Assembling Memory Module
Wireless LAN Module
HDD Module
Ba ttery Module
Upgrade & Replacement
A
CPU Upgrade
Page
Unlock
Loc k
Page
Second Memory Upgrade
Page
Page
HDD Upgrade
Page
Page
Page
Page
Page
ODD R eplacement
Page
Page
HARDWARE SPECIFICATION
T
Hardware Specifications
HARDWARE SPECIFICATION
1 MARKETING SPEC
S62F Specification (Two-Spindle Design)
Page
Page
Page
Page
Page
Page
2 CHIPSET LIST
2.1 CPU
2.2 CHIPSET
2.2.1 North Bridge
2.2.2 South Bridge
IRQ Controller
2.4 BIOS ROM
2.5 INTERNAL VGA CONTROLLER
2.6 I/O INTERFACE Controller
2.7 PCMCIA Controller
2.8 KEYBOARD CONTROLLER
2.9 AUDIO CODEC
2.10 AUDIO AMPLIFIER
2.11 LAN & MODEM
2.11.1 LAN
2.11.2 MODEM
3 KEY PARTS LIST
Page
Page
3.1 Display
3.2 Hard Disk Drive
3.3 Combo Drive
3.4 DVD-Dual Drive
3.5 Touch Pad
3.6 Keyboard
3.7 Battery
3.7.1 Main Battery
3.8 AC/DC Adapter
Page
Page
4.2 Main components block diagrams
4.3 System resource
4.3.1 IRQ Map
4.3.2 ISA DMA Map
4.3.3 PCI INT Map
4.3.4 PCI Bus Master Map
4.3.5 IDSEL
5 I/O PORT PIN ASSIGNMENT
5.1 CRT
Page
5.2 Hard disk pin assignment
5.3 ODD pin assignment
Page
5.4 LCD pin assignment
Page
5.5 Internal keyboard pin assignment
5.6 Internal Touch Pad Pin assignment
5.7 1ST Battery pin assignment
5.8 DC in Jack pin assignment
5.9 Audio Jack
5.9.1 Internal Speaker Jack
5.9.2 Headphone Jack
5.9.3 Microphone Jack
5.10 Fan Pin Assignment
5.11 Inverter pin assignment
5.12 MDC signal
5.13 1394 pin assignment
5.14 USB pin assignment
5.15 LAN & Modem pin assignment
5.16 Card Reader pin assignment
6 POWER MANAGEMENT 6.1 System power plane
6.2 Power management mode
6.2.1 Full-On mode
6.2.2 Doze mode
6.2.3 Stand by mode
6.2.4 Suspend to RAM mode (STR)
Page
6.3.1 Lid switch
6.3.2 Power button
6.4 Device Power management
Page
6.4.1 Device PM control during Stand By mode
6.4.2 Device PM control during STR mode
6.4.3 Device PM control during STD mode
7 MODULE SPECIFICATION 7.1 Overall System
7.1.1 Board assembly
7.2 Processor
7.3 Main board
7.3.1 Main system module spec
7.3.2 DC/DC module spec
7.3.3 Charger
7.4 Inverter Board
7.5 Adapter spec
7.5.1 Input
7.5.2 Output
7.5.3 Protection
7.6 Main Battery spec
7.7 LAN Spec
7.8 Modem spec
8 MISCELLANEOUS 8.1 Indicators
8.2 Power cord list
8.3 Safety/ EMI Appliance (TBD):
T
Softw ar e Specifica tions
Chapter
1. General Description
2. Summary of Hardware Configuration
2.3.2 PCI Devices Vendor/Device IDs and Sub-System/Vendor IDs
Page
3. Summary of BI OS Requirements
4. BIOS Features
4.4 SUPER I/O
Page
Page
Page
Page
Page
5. GPIO Pin Assignment
Page
Page
Page
Page
6. Devices
Page
Page
Page
7. CMOS Setup Utility
Page
Page
Page
7.3 SECURITY MENU:
7.4 POWER MENU:
7.5 BOOT MENU:
7.6 EXIT MENU:
Page
9. Embedded Controller (EC)
9.2 INSTANT KEYS
9.3.2 Internet Key